Cărți de John Lau

Through-Silicon Vias for 3D Integration

16 dec 2012

Preț: 991^.15 lei 1208^.72 lei

6-8 săpt.

-18%

Basics Fashion Design 09: Designing Accessories: Exploring the design and construction of bags, shoes, hats and jewellery

Basics Fashion Design

20 ian 2019

Preț: 187^.07 lei 218^.12 lei

22-28 zile

-14%

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

Autor John Lau et al.

19 mai 2025

Preț: 1091^.73 lei 1417^.84 lei

38-44 zile

-23%

Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration

Autor John Lau et al.

27 iun 2026

Preț: 1264^.42 lei 1580^.53 lei

Indisponibil temporar

-20% Nou

3D IC Integration and Packaging

16 oct 2015

Preț: 1063^.82 lei 1790^.16 lei

43-49 zile

-41%

Thermal Stress and Strain in Microelectronics Packaging

Editat de John Lau

29 apr 2012

Preț: 933^.61 lei 1138^.55 lei

6-8 săpt.

-18%

Textomancy

Autor Benjamin Lee et al.

Preț: 47^.33 lei

3-5 săpt.