Cărți de John Lau

Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration

Autor John Lau et al.

iun 2026

Preț: 1244^.24 lei 1517^.37 lei

6-8 săpt.

-18%

Through-Silicon Vias for 3D Integration

16 dec 2012

Preț: 1046^.03 lei 1275^.65 lei

6-8 săpt.

-18%

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

Autor John Lau et al.

19 mai 2025

Preț: 1142^.42 lei 1393^.21 lei

3-5 săpt. | 10-14 zile

-18%

Basics Fashion Design 09: Designing Accessories: Exploring the design and construction of bags, shoes, hats and jewellery

Basics Fashion Design

20 ian 2019

Preț: 191^.08 lei 218^.15 lei

20-31 zile

-12%

3D IC Integration and Packaging

16 oct 2015

Preț: 1106^.50 lei 1818^.60 lei

41-52 zile

-39%

Thermal Stress and Strain in Microelectronics Packaging

Editat de John Lau

29 apr 2012

Preț: 933^.61 lei 1138^.55 lei

6-8 săpt.

-18%

Textomancy

Autor Benjamin Lee et al.

Preț: 47^.33 lei

3-5 săpt.