Cărți de John Lau

Through-Silicon Vias for 3D Integration

16 dec 2012

Preț: 927^.15 lei 1422^.62 lei

40-51 zile

-35%

Basics Fashion Design 09: Designing Accessories: Exploring the design and construction of bags, shoes, hats and jewellery

Basics Fashion Design

20 ian 2019

Preț: 180^.36 lei 233^.50 lei

22-36 zile

-23%

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

Autor John Lau et al.

19 mai 2025

Preț: 1055^.30 lei 1370^.52 lei

38-44 zile

-23%

3D IC Integration and Packaging

16 oct 2015

Preț: 1127^.56 lei 1730^.69 lei

40-51 zile

-35%

Thermal Stress and Strain in Microelectronics Packaging

Editat de John Lau

29 apr 2012

Preț: 933^.61 lei 1138^.55 lei

43-57 zile

-18%

Textomancy

Autor Benjamin Lee et al.

Preț: 47^.33 lei

22-36 zile