Filtre: McGraw Hill Education

Cărți de John Lau

Through-Silicon Vias for 3D Integration

16 dec 2012

Preț: 928^.15 lei 1423^.74 lei

43-48 zile

-35%

3D IC Integration and Packaging

16 oct 2015

Preț: 1128^.77 lei 1732^.06 lei

43-48 zile

-35%