Filtre: McGraw Hill Education

Cărți de John Lau

Through-Silicon Vias for 3D Integration

16 dec 2012

Preț: 1005^.73 lei 1226^.49 lei

6-8 săpt.

-18%

3D IC Integration and Packaging

16 oct 2015

Preț: 1077^.60 lei 1786^.90 lei

45-50 zile

-40%