Filtre: Engleză

Cărți de John Lau

Through-Silicon Vias for 3D Integration

16 dec 2012

Preț: 932^.66 lei 1423^.69 lei

45-50 zile

-34%

Basics Fashion Design 09: Designing Accessories: Exploring the design and construction of bags, shoes, hats and jewellery

Basics Fashion Design

20 ian 2019

Preț: 181^.45 lei 242^.41 lei

24-29 zile

-25%

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

Autor John Lau et al.

19 mai 2025

Preț: 1055^.30 lei 1370^.52 lei

38-44 zile

-23%

Cu-Interconnects, Glass, and Ai-Assisted Simulation for Chiplets and Heterogeneous Integration

Autor John Lau et al.

15 apr 2026

Preț: 1173^.54 lei 1431^.15 lei

Nepublicat încă

-18% Precomandă

Thermal Stress and Strain in Microelectronics Packaging

Editat de John Lau

29 apr 2012

Preț: 933^.61 lei 1138^.55 lei

6-8 săpt.

-18%

Textomancy

Autor Benjamin Lee et al.

Preț: 47^.33 lei

3-5 săpt.