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Cărți de John Lau

Through-Silicon Vias for 3D Integration

16 dec 2012

Preț: 927^.15 lei 1422^.62 lei

45-50 zile

-35%

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

Autor John Lau et al.

19 mai 2025

Preț: 1055^.30 lei 1370^.52 lei

38-44 zile

-23%

Thermal Stress and Strain in Microelectronics Packaging

Editat de John Lau

29 apr 2012

Preț: 933^.61 lei 1138^.55 lei

6-8 săpt.

-18%

Textomancy

Autor Benjamin Lee et al.

Preț: 47^.33 lei

3-5 săpt.