Cărți de John Lau

Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration

Autor John Lau et al.

7 iun 2026

Preț: 1224^.43 lei 1530^.53 lei

Nepublicat încă

-20% Precomandă

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

Autor John Lau et al.

19 mai 2025

Preț: 1056^.70 lei 1372^.34 lei

39-44 zile

-23%

Thermal Stress and Strain in Microelectronics Packaging

Editat de John Lau

29 apr 2012

Preț: 933^.61 lei 1138^.55 lei

6-8 săpt.

-18%

Through-Silicon Vias for 3D Integration

16 dec 2012

Preț: 973^.31 lei 1186^.97 lei

6-8 săpt.

-18%

Basics Fashion Design 09: Designing Accessories: Exploring the design and construction of bags, shoes, hats and jewellery

Basics Fashion Design

20 ian 2019

Preț: 181^.45 lei 226^.80 lei

22-27 zile

-20%

Textomancy

Autor Benjamin Lee et al.

Preț: 47^.33 lei

3-5 săpt.