Filtre: Hardback

Cărți de John Lau

Through-Silicon Vias for 3D Integration

16 dec 2012

Preț: 980^.69 lei 1195^.96 lei

6-8 săpt.

-18%

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

Autor John Lau et al.

19 mai 2025

Preț: 1091^.73 lei 1417^.84 lei

38-44 zile

-23%

Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration

Autor John Lau et al.

24 mai 2026

Preț: 1265^.04 lei 1581^.31 lei

Nepublicat încă

-20% Precomandă

3D IC Integration and Packaging

16 oct 2015

Preț: 1063^.82 lei 1790^.16 lei

45-50 zile

-41%