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Cărți de John Lau

Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration

Autor John Lau et al.

iun 2026

Preț: 1241^.20 lei 1513^.66 lei

6-8 săpt.

-18%

Through-Silicon Vias for 3D Integration

16 dec 2012

Preț: 1009^.35 lei 1230^.91 lei

6-8 săpt.

-18%

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

Autor John Lau et al.

19 mai 2025

Preț: 1091^.73 lei 1417^.84 lei

38-44 zile

-23%

3D IC Integration and Packaging

16 oct 2015

Preț: 1077^.64 lei 1793^.57 lei

45-50 zile

-40%