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Mechatronic Reliability

Autor Wei Yang
en Limba Engleză Hardback – 13 ian 2003
This book is a monograph about Mechatronic Reliability, an emerging branch of modern technology. It addresses professionals, graduate students and even senior undergraduates engaged in the research of solid mechanics, material sciences, microelectronics, solid state physics and mechanical engineering. The framework of mechatronic reliability unfolds in four parts, according to the sequence of electric failures, mechanical-electrical coupling, domain switching and mass-flow instability. Various subjects treated in the book are positioned along the interface between mechanics and electronics. Typical failure modes for materials under electrical and/or mechanical loading are identified. Analyses devoted to those failure modes reveal their mechanisms, and establish new theories for the assessment of their reliability.
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Specificații

ISBN-13: 9783540422839
ISBN-10: 3540422838
Pagini: 340
Ilustrații: VI, 324 p.
Dimensiuni: 160 x 241 x 23 mm
Greutate: 0.62 kg
Ediția:2003
Editura: Springer Berlin, Heidelberg
Locul publicării:Berlin, Heidelberg, Germany

Public țintă

Research

Cuprins

Introduction.-Electric fracture.-Electrically induced fatigue cracking.-Current induced mass-flow instability.- Piezoelectriecs.- Relaxor ferroelectrics.- Ferroelectrics.- Theory and experiments of domain switch.- Fracture toughness and polarization.- Cyclic switch and fatigue cracking.-Mass-flow under mechatronic fields.- Microstructural evolution.- Mass-flow instability.-Concluding Remarks.

Caracteristici

First mechatronics book dealing with coupled mechanical and electrical actions The author is the leading scientist in this field

Notă biografică

Prof. Chi Lin received B.E. and Ph.D. degrees from Dalian University of Technology, Dalian, China, in 2008 and 2013, respectively. He has been an assistant professor with the School of Software, Dalian University of Technology, since 2014. Since 2017, he has been an associate professor with the School of Software, Dalian University of Technology. He has authored more than 50 scientific papers in several journals and conferences, including MobiCom, INFOCOM, SECON, ICDCS, ICNP, ICPP, IEEE/ACM ToN, IEEE TMC, ACM TECS, ACM TOSN, IEEE TVT, and special issue of SCIENCE. His research interests include pervasive computing and wireless sensor networks. In 2015, he was the recipient of the ACM Academic Rising Star. Dr. Yu Sun received B.E. and M.E. degrees from Dalian University of Technology, Dalian, China, in 2018 and 2020, respectively. He is currently studying Ph.D. degree in School of Software, Dalian University of Technology. His research interests cover wireless power transfer and wireless rechargeable sensor networks. He has authored nearly 10 scientific papers in several journals and conferences, including INFOCOM, IEEE/ACM ToN, ICNP, SECON, ICPP, and CN. Dr. Wei Yang received B.E. degree in the School of Software from Zhengzhou University, Zhengzhou, China, in 2020. He is currently studying Eng.D. degree in the School of Software, Dalian University of Technology, Dalian, China. His research interests focus on wireless charging and wireless sensor networks. He has authored several scientific papers in top-ranked journals and conferences, including IEEE TMC, IEEE/ACM ToN, ICDCS, etc.