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Cărți de John Lau

Through-Silicon Vias for 3D Integration

16 dec 2012

Preț: 925^.09 lei 1422^.73 lei

41-52 zile

-35%

3D IC Integration and Packaging

16 oct 2015

Preț: 1125^.04 lei 1730^.82 lei

41-52 zile

-35%

Thermal Stress and Strain in Microelectronics Packaging

Editat de John Lau

29 apr 2012

Preț: 933^.61 lei 1138^.55 lei

6-8 săpt.

-18%

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

Autor Xuejun Fan et al.

19 mai 2025

Preț: 1055^.38 lei 1370^.62 lei

38-44 zile

-23%