Filtre: Tipărit la comandă

Cărți de John Lau

Through-Silicon Vias for 3D Integration

16 dec 2012

Preț: 928^.15 lei 1423^.74 lei

40-51 zile

-35%

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

16 dec 2010

Preț: 797^.12 lei 926^.89 lei

43-57 zile

-14%

3D IC Integration and Packaging

16 oct 2015

Preț: 1128^.77 lei 1732^.06 lei

40-51 zile

-35%

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

Autor Xuejun Fan et al.

19 mai 2025

Preț: 1056^.13 lei 1371^.59 lei

38-44 zile

-23%

Thermal Stress and Strain in Microelectronics Packaging

Editat de John Lau

29 apr 2012

Preț: 933^.61 lei 1138^.55 lei

43-57 zile

-18%