Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Autor John Lau et al.
19 mai 2025
Hardback
Preț: 1055.30 lei 1370.52 lei
38-45 zile
-23%
Cărți de John Lau
Thermal Stress and Strain in Microelectronics Packaging
Editat de John Lau
29 apr 2012
Paperback
Preț: 933.61 lei 1138.55 lei
6-8 săpt.
-18%
Textomancy
Autor Benjamin Lee et al.
Paperback
Preț: 47.33 lei
3-5 săpt.