IUTAM Symposium on Field Analyses for Determination of Material Parameters — Experimental and Numerical Aspects: Proceedings of the IUTAM Symposium held in Abisko National Park, Kiruna, Sweden, July 31 – August 4, 2000: Solid Mechanics and Its Applications, cartea 109

Experimental Methods.- Whole-Field Displacement Measurement With Moiré Interferometry as a Basis for a Microstructural FE Model of a Polymer Bonded Explosive.- Measurement of Microscopic Residual Stress Based on the Evolution of Surface Roughness During Shallow Chemical Etching.- The Incubation Time Theory and Experiment.- Affordable TMF Testing Supported by FE Simulation.- Identification of Dynamic Properties of Railway Track.- Optical Method to Study Material Behaviour at High Strain Rates.- Determination of Cylindrical Elastic Orthotropy in Wood by Digital Speckle Photography.- Optimization Techniques and Simulation Methods.- Identification of Elastic/Visco-Plastic Material Constants Under Impact Loading.- Parameter Identification for Inverse Problems in Metal Forming Simulations.- One Step Prediction Error Approach to the Identification Problem of Creep and Viscoplastic Material Models.- Automated Identification and Calculation of the Parameters of Non-Linear Material Models.- Inversion Method Using Spectral Decomposition of Green’S Functions.- Determination of Ballast Parameters of Railway Track Using an Optimisation Technique.- Estimation of Material Parameters at Elevated Temperatures by Inverse Modelling of A Gleeble Experiment.- Material Modeling.- Hydride-Induced Embrittlement in Metals -Stress and Temperature Effects.- A Non-Isothermal Model for the Phase Transformations and the Mechanical Behaviour of a 12% Chromium Steel.- Size Effect on Stress-Intensity Factors of CNS Specimen With an Interface Crack Subjected To Mixed-Mode Loading.- On Pennyshaped Equilibrium Cracks in Materials Reinforced by Fibers.- Identification of Stress from Strain for Body With Not Fully Identified Constitutive Relations.- Evaluation Method of Interface Strength Between ThinFilms In LSI.- List of Authors.