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Dislocation Dynamics During Plastic Deformation: Springer Series in Materials Science, cartea 129

Autor Ulrich Messerschmidt
en Limba Engleză Paperback – 5 sep 2012

Din seria Springer Series in Materials Science

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Specificații

ISBN-13: 9783642263576
ISBN-10: 3642263577
Pagini: 520
Ilustrații: XIII, 503 p.
Dimensiuni: 155 x 235 x 28 mm
Greutate: 0.78 kg
Ediția:2010
Editura: Springer
Colecția Springer Series in Materials Science
Seria Springer Series in Materials Science

Locul publicării:Berlin, Heidelberg, Germany

Public țintă

Research

Cuprins

General Properties of Dislocation Motion.- Experimental Methods.- Properties of Dislocations.- Dislocation Motion.- Dislocation Kinetics, Work-Hardening, and Recovery.- Dislocation Motion in Particular Materials.- Semiconductors.- Ceramic Single Crystals.- Metallic Alloys.- Intermetallic Alloys.- Quasicrystals.- Conclusion.

Textul de pe ultima copertă

The book gives an overview of the dynamic behavior of dislocations and its relation to plastic deformation. It introduces the general properties of dislocations and treats the dislocation dynamics in some detail. Finally, examples are described of the processes in different classes of materials, i.e. semiconductors, ceramics, metals, intermetallic materials, and quasicrystals. The processes are illustrated by many electron micrographs of dislocations under stress and by video clips taken during in situ straining experiments in a high-voltage electron microscope showing moving dislocations. Thus, the users of the book also obtain an immediate impression and understanding of dislocation dynamics.

Caracteristici

Covers the major achievements in the understanding of the dynamics and the formation of dislocations in solid materials during the plastic deformation A special feature are the excellent TEM micrographs to explain the features of dislocations Another didactically important component is the demonstration of dislocation motion and formation during plastic deformation, shown in video sequences which can be downloaded from the Springer homepage Both a reference work and an excellent study text Includes supplementary material: sn.pub/extras