Electromigration in ULSI Interconnections: Modeling, Analysis and Numerical Simulations International Series on Advances in Solid State Electronics and Technology (Unnumbered) Autor Cher Ming Tan 24 iun 2010 Hardback Preț: 632.56 lei 744.19 lei 6-8 săpt. -15%
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections Springer Series in Reliability Engineering Autor Cher Ming Tan et al. 21 apr 2013 Paperback Preț: 609.08 lei 716.56 lei 6-8 săpt. -15%
Theory and Practice of Quality and Reliability Engineering in Asia Industry Editat de Cher Ming Tan et al. 14 iul 2018 Paperback Preț: 1170.37 lei 1427.28 lei 6-8 săpt. -18%
Electromigration Modeling at Circuit Layout Level SpringerBriefs in Applied Sciences and Technology Autor Cher Ming Tan et al. 4 mai 2013 Paperback Preț: 363.41 lei 6-8 săpt.
Reliability and Failure Analysis of High-Power LED Packaging Woodhead Publishing Series in Electronic and Optical Materials Autor Cher Ming Tan et al. 28 sep 2022 Paperback Preț: 921.16 lei 1273.35 lei 5-7 săpt. -28%