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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments: Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems

Autor Juan Cepeda-Rizo, Jeremiah Gayle, Joshua Ravich
en Limba Engleză Hardback – 24 dec 2026
Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments provides cutting-edge information on how to design, analyze, and test in the fast-paced and low-cost small satellite environment. It also presents techniques to reduce the design and test cycles without compromising reliability. Further, the book serves both as a reference and a training manual for designing satellites to withstand the structural and thermal challenges of extreme environments in outer space. It provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for designing spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars. 
  • Provides updates throughout and includes an all-new chapter on Reliability.  
  • Includes case studies from NASA’s Jet Propulsion Laboratory, which prides itself in robotic exploration of the solar system, as well as flying the first CubeSat to Mars.  
  • Examines innovative low-cost thermal and power systems.  
  • Explains how to design to survive rocket launch, as well as the surfaces of Mars and Venus. 
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Specificații

ISBN-13: 9781041216919
ISBN-10: 1041216912
Pagini: 304
Ilustrații: 464
Dimensiuni: 156 x 234 mm
Ediția:2
Editura: CRC Press
Colecția CRC Press
Seria Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems


Public țintă

Professional Reference

Cuprins

Introduction. New Space. Thermal/Structural Challenges in Miniaturizing. Fundamental of Heat Transfer by Conduction and Convection. Fundamentals of Heat Transfer by Radiation. The Multi-Layer Insulation (MLI) Blanket. Heat Pipes. Convective Cooling of Semiconductors using a Nanofluid. Power Systems: The Tesla Turbine. Electronics Design for Extreme Temperature and Pressure. Characterization and Modeling of PWB Warpage and its Effect on LGA Separable Interconnects. Resistor Networks. Thermal Analysis Case Studies. Random Vibration Structural Analysis and Mile’s Equation. Vibrational Analysis Case Studies. Creep Prediction of a Printed Wiring Board for Separable Land Grid Array Connector. Operational Case Studies – Mars Surface Operations. Operational Case Studies – Dawn Asteroid Mission. Standards.

Notă biografică

Juan Cepeda-Rizo earned his B.S. in Mechanical Engineering and M.S. in Materials Engineering from California Polytechnic State University, San Luis Obispo, in 1997. He began his career in the semiconductor industry, specializing in electronic packaging analysis for advanced microelectronic systems. He later obtained a Ph.D. in Applied Mathematics from Claremont Graduate University and went on to spend more than a decade at NASA’s Jet Propulsion Laboratory, where he served as a thermal systems engineer supporting space exploration missions and advanced aerospace technologies. 
 
Dr. Cepeda-Rizo has also contributed to the commercial space industry through leadership and engineering roles at several pioneering NewSpace companies, including Rocket Lab and Vast Space in Long Beach, California. His expertise spans thermal and structural analysis, electronic packaging reliability, spacecraft systems, and engineering for extreme environments. 
 
Jeremiah Gayle is a Staff Mechanical Engineer at Apex Spacecraft Manufacturing, where he works on spacecraft mechanical systems and electronics packaging. Prior to joining Apex, he worked at Blue Origin on spacecraft electronics packaging for Blue Ring. He previously spent eight years at the NASA Jet Propulsion Laboratory, supporting mission formulation, electronics packaging, and thermal-structural analysis for multiple spaceflight missions. He earned a bachelor’s degree in mechanical engineering from Arizona State University, master’s degrees from Iowa State University and Johns Hopkins University, and a Doctor of Engineering in Mechanical Systems Engineering from Colorado State University. 
 
Joshua Ravich is a supervisor for the Technology Infusion group at JPL, where he works on the mechanical design and analysis of spacecraft systems. His recent work has included the Mars Helicopter project. He received a bachelor's degree in mechanical Engineering from UC Berkeley and a master's in mechanical and aerospace engineering from the University of Michigan. 

Descriere

Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments has cutting-edge information on how to design, analyze, and test in the small satellite environment.