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SiP System–in–Package Design and Simulation: Mentor EE Flow Advanced Design Guide

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Notă GoodReads:
en Limba Engleză Carte Hardback – 11 Sep 2017

An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow

Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture.

Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including:

  • Cavity and sacked dies design
  • FlipChip and RDL design
  • Routing and coppering
  • 3D Real-Time DRC check
  • SiP simulation technology
  • Mentor SiP Design and Simulation Platform

Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.

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Specificații

ISBN-13: 9781119045939
ISBN-10: 1119045932
Pagini: 496
Dimensiuni: 170 x 247 x 28 mm
Greutate: 0.91 kg
Editura: Wiley
Locul publicării: Singapore, Singapore

Public țintă

P&R Tier 2
Primary: SiP designers, package designers, advanced PCB designers, system designers interested in electronic system minimization
Secondary: Package design managers; senior graduate students on electrical engineering courses