Semiconductor Wafer Bonding
Autor Q -Y Tong, U. Göseleen Limba Engleză Hardback – 7 dec 1998
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Specificații
ISBN-13: 9780471574811
ISBN-10: 0471574813
Pagini: 320
Dimensiuni: 161 x 240 x 22 mm
Greutate: 0.65 kg
Ediția:New.
Editura: Wiley
Locul publicării:Hoboken, United States
ISBN-10: 0471574813
Pagini: 320
Dimensiuni: 161 x 240 x 22 mm
Greutate: 0.65 kg
Ediția:New.
Editura: Wiley
Locul publicării:Hoboken, United States
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Public țintă
Materials Scientists and Engineers, Graduate Students and Professionals in Solid State Science and Electronics (Physics, Inorganic Chemistry, Materials Science, Electronics and Electrical Engineering).Descriere
Though there has been a lot of scattered information on specific aspects of wafer bonding--a technique for welding semiconductor wafers together without using glue, this is one of the first practical works to bring together a broad range of information into a coherent overview of the field.