Precision Assembly Technologies and Systems: 7th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2014, Chamonix, France, February 16-18, 2014, Revised Selected Papers: IFIP Advances in Information and Communication Technology, cartea 435
Editat de Svetan Ratcheven Limba Engleză Hardback – 3 dec 2014
| Toate formatele și edițiile | Preț | Express |
|---|---|---|
| Paperback (3) | 328.58 lei 38-44 zile | |
| Springer Berlin, Heidelberg – 11 sep 2016 | 328.58 lei 38-44 zile | |
| Springer Berlin, Heidelberg – 13 apr 2014 | 332.42 lei 38-44 zile | |
| Springer Berlin, Heidelberg – 4 mai 2012 | 623.39 lei 6-8 săpt. | |
| Hardback (3) | 321.35 lei 6-8 săpt. | |
| Springer Berlin, Heidelberg – 3 dec 2014 | 321.35 lei 6-8 săpt. | |
| Springer Berlin, Heidelberg – 17 feb 2012 | 322.43 lei 6-8 săpt. | |
| Springer Berlin, Heidelberg – 9 feb 2010 | 628.95 lei 6-8 săpt. |
Din seria IFIP Advances in Information and Communication Technology
- 20%
Preț: 559.95 lei - 20%
Preț: 746.71 lei - 20%
Preț: 555.69 lei - 20%
Preț: 623.07 lei - 20%
Preț: 623.39 lei - 20%
Preț: 327.36 lei -
Preț: 382.30 lei - 20%
Preț: 323.23 lei - 20%
Preț: 327.99 lei - 20%
Preț: 528.48 lei - 15%
Preț: 527.06 lei - 20%
Preț: 527.38 lei - 20%
Preț: 424.44 lei - 15%
Preț: 624.01 lei - 20%
Preț: 1116.37 lei - 18%
Preț: 909.08 lei - 20%
Preț: 1232.88 lei - 20%
Preț: 689.95 lei - 18%
Preț: 911.54 lei - 15%
Preț: 616.15 lei - 18%
Preț: 1216.83 lei - 15%
Preț: 613.18 lei - 15%
Preț: 611.74 lei - 20%
Preț: 957.62 lei - 20%
Preț: 619.71 lei - 15%
Preț: 616.45 lei - 20%
Preț: 944.97 lei - 20%
Preț: 1231.59 lei - 20%
Preț: 1226.84 lei - 20%
Preț: 616.05 lei - 20%
Preț: 1232.08 lei - 20%
Preț: 952.00 lei - 20%
Preț: 1232.88 lei - 18%
Preț: 1183.12 lei - 15%
Preț: 611.23 lei - 18%
Preț: 911.54 lei - 18%
Preț: 1171.97 lei - 20%
Preț: 1848.88 lei - 15%
Preț: 611.23 lei - 18%
Preț: 914.70 lei - 20%
Preț: 968.03 lei - 20%
Preț: 2110.89 lei - 20%
Preț: 1237.63 lei - 20%
Preț: 634.64 lei - 20%
Preț: 623.22 lei - 20%
Preț: 1235.90 lei - 20%
Preț: 1327.97 lei - 18%
Preț: 1180.37 lei - 20%
Preț: 623.18 lei
Preț: 321.35 lei
Preț vechi: 401.68 lei
-20% Nou
Puncte Express: 482
Preț estimativ în valută:
56.86€ • 66.77$ • 49.91£
56.86€ • 66.77$ • 49.91£
Carte tipărită la comandă
Livrare economică 27 ianuarie-10 februarie 26
Preluare comenzi: 021 569.72.76
Specificații
ISBN-13: 9783662455852
ISBN-10: 3662455854
Pagini: 171
Ilustrații: XII, 171 p. 129 illus. in color.
Dimensiuni: 155 x 235 x 17 mm
Greutate: 0.46 kg
Ediția:2014
Editura: Springer Berlin, Heidelberg
Colecția Springer
Seria IFIP Advances in Information and Communication Technology
Locul publicării:Berlin, Heidelberg, Germany
ISBN-10: 3662455854
Pagini: 171
Ilustrații: XII, 171 p. 129 illus. in color.
Dimensiuni: 155 x 235 x 17 mm
Greutate: 0.46 kg
Ediția:2014
Editura: Springer Berlin, Heidelberg
Colecția Springer
Seria IFIP Advances in Information and Communication Technology
Locul publicării:Berlin, Heidelberg, Germany
Public țintă
ResearchCuprins
Robust Adhesive Precision Bonding in Automated Assembly Cells.- Assembly of Silicon Micro-parts with Steel Spindles Using Low-Temperature Soldering.- Testing the Mechanical Characteristics and Contacting Behaviour of Novel Manufactured and Assembled Sphere-Tipped Styli for Micro-CMM Probes.- Ultrasonic Press–Fitting: A New Assembly Technique.- Precision Micro Assembly of Optical Components on MID and PCB.- Integrated Tool-Chain Concept for Automated Micro-optics Assembly.- Feeding of Small Components Using the Surface Tension of Fluids.- Precision Handling of Electronic Components for PCB Rework.- Shift Dynamics of Capillary Self-Alignment.- Image Stitching Based Measurements of Medical Screws.- Concept of a Virtual Metrology Frame Based on Absolute Interferometry for Multi Robotic Assembly.- Application of Deep Belief Networks for Precision Mechanism Quality Inspection.- Visual Quality Inspection and Fine Anomalies: Methods and Application.- Control Methods in Microspheres Precision Assembly for Colloidal Lithography.- A Multi-Agent System Architecture for Self-configuration.- Process Module Construction Kit for Modular Micro Assembly Systems.- Modular Workpiece Carrier System for Micro Production.- A Generic Systems Engineering Method for Concurrent Development of Products and Manufacturing Equipment.- The SMARTLAM 3D-I Concept: Design of Microsystems from Functional Elements Fabricated by Generative Manufacturing Technologies.- Optimal Design of Remote Center Compliance Devices of Rotational Symmetry.
Textul de pe ultima copertă
This book constitutes the refereed proceedings of the 6th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2012, held in Chamonix, France, in February 2012. The 15 revised full papers were carefully reviewed and selected from numerous submissions. The papers are organized into the following topical sections: micro processes and systems; handling and manipulation in assembly; tolerance management and error compensation methods; metrology and quality control; intelligent control of assembly systems; and process selection and modelling techniques.
Caracteristici
State-of-the-art research Fast-track conference proceedings Unique visibility