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Nanopackaging: Nanotechnologies and Electronics Packaging de James E. Morris

Nanopackaging: Nanotechnologies and Electronics Packaging

Editat de James E. Morris
en Limba Engleză Hardback – 2 oct 2018
This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, applications of nanoparticles, graphene, carbon nanotubes and nanowires in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement.

Now in a widely extended second edition, Nanopackaging is an important reference for industrial and academic researchers, as well as practicing engineers seeking information about latest techniques. Twelve new chapters address carbon nanotubes and nanowires, fabrication and properties of graphene, graphene for thermal cooling of microelectronics and for electrical interconnections, packaging of post-CMOS nanoelectronics, environmental and health effects of nanopackaging technologies, and more. This book is an ideal reference for researchers, practicing engineers, and graduate students who are either entering the field for the first time, or are already conducting research and want to expand their knowledge in the field of nanopackaging.

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Specificații

ISBN-13: 9783319903613
ISBN-10: 3319903616
Pagini: 1008
Ilustrații: XXVIII, 996 p. 635 illus., 419 illus. in color.
Dimensiuni: 155 x 235 mm
Greutate: 1.6 kg
Ediția:2nd ed. 2018
Editura: Springer International Publishing
Colecția Springer
Locul publicării:Cham, Switzerland

Cuprins

Nanopackaging: Nanotechnologies and Electronics Packaging.- Modelling Technologies and Applications.- Advances in Delamination Modeling: Continuum Aspects.- Advances in Delamination Modeling: Atomistic Aspects.- Soft Mold Nano-imprint: Modeling and Simulation.- Nanoparticle Properties.- Nanoparticle Fabrication.- Nanoparticle-based High-k Dielectric Composites for Embedded Capacitors.- Nanostructured Materials for Embedded Resistors.- Nanogranular Magnetic Core Inductors: Design, Fabrication and Packaging.- Nanoparticles in Isotropic Conductive Adhesives.- Nano materials in Anisotropic Conductive Adhesives (ACAs).- Nanoparticles in Microvias.- Silver Nanoparticles for Inkjet Printed Conductive Structures in Electronic Packaging.- A Study of Nano Particles in SnAg-Based Lead Free Solders.- Nano-Underfills for Fine Pitch Electronics.- Carbon Nanotubes: Synthesis and Characterization.- Characteristics of Carbon Nanotubes for Nanoelectronic Device Applications.- High Electromagnetic Shielding of Plastic Transceiver Packaging Using Dispersed Multiwall Carbon Nanotubes.- Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced with Single-Wall Carbon Nanotubes.- Carbon Nanotubes for Thermal Management of Microsystems.- Nanowires in Electronics Packaging.- Nanowire ACF for Ultrafine pitch Flip-Chip Interconnection.- Synthesis and Optical Characterization of CVD Graphene.- Characterization of electronic, electrical, optical and mechanical properties of grapheme.- Graphene for Thermal Cooling of Microelectronics.- Carbon Interconnects.- Design and Development of Stress-Engineered Compliant Interconnect for Microelectronic Packaging.- Nanosensors for Electronics Package Reliability.- Applications of Bio-Nanotechnology to Electronics Packaging.- Flip Chip Packaging for Nanoscale Silicon Logic Devices: Challenges and Opportunities.- Nanotechnology Health, Safety, Environment Overview.

Notă biografică

James E. Morris is Professor of Electrical & Computer Engineering at Portland State University, Oregon. He has edited or co-authored five books on electronic packaging, and has more on the way.

Textul de pe ultima copertă

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, applications of nanoparticles, graphene, carbon nanotubes and nanowires in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement.
Now in a second edition, Nanopackaging is an important reference for industrial and academic researchers, as well as practicing engineers seeking information about latest techniques. 12 new chapters address carbon nanotubes and nanowires, fabrication and properties of graphene, graphene for thermal cooling of microelectronics and for electrical interconnections, packaging of post-CMOS nanoelectronics, environmental and health effects of nanopackaging technologies, and more. This book is an ideal reference for researchers, practicing engineers, and graduate students who are either entering the field for the first time, or are already conducting research and want to expand their knowledge in the field of nanopackaging.

Caracteristici

Discusses the importance of computer modeling in nanopackaging and offers suggestions for implementation Contains 12 new chapters from internationally recognized contributors, as well as updates in all existing chapters Brings together a comprehensive overview of nanoscale electronics and systems and covers structures, nanoelectronics packaging and interconnects, and offers a roadmap for future trends

Descriere

Descriere de la o altă ediție sau format:
Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior mechanical, electrical, or thermal properties of carbon nanotubes. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement. “Nanopackaging” is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of their field, and others with interests in nanotechnology. It will survey the application of nanotechnologies to electronics packaging, as represented by current research across the field.

Recenzii

From the reviews:“This is an impressive work that provides a substantial and relatively in depth coverage of a wide range of electronics packaging and assembly related applications for nanotechnology. Each chapter concludes with a list of references that can be used by the reader to further investigate a particular subject and the book is well produced with good quality figures and illustrations. … I am pleased to be able to conclude this … Nanopackaging: Nanotechnologies and Electronics Packaging as ‘highly recommended’.” (Martin Goosey, Microelectronics International, Vol. 26 (3), 2009)