3D Integration for VLSI Systems
Editat de Chuan Seng Tan et al.
26 sep 2011
Hardback
Preț: 931.19 lei 1135.60 lei
6-8 săpt.
-18%
Cărți de Kuan-Neng Chen
Encyclopedia of Packaging Materials, Processes, and Mechanics - Set 1: Die-Attach and Wafer Bonding Technology (a 4-Volume Set)
Editat de Pengli Zhu et al.
18 oct 2019
Hardback
Preț: 8746.98 lei 10667.04 lei
Indisponibil temporar
-18%