Encyclopedia of Packaging Materials, Processes, and Mechanics - Set 1: Die-Attach and Wafer Bonding Technology (a 4-Volume Set)
Editat de Pengli Zhu et al.
18 oct 2019
Hardback
Preț: 8746.98 lei 10667.04 lei
Indisponibil temporar
-18%
Pengli Zhu