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Electronic Packaging and Interconnects

High-Frequency Characterization of Electronic Packaging

Electronic Packaging and Interconnects, nr. 1

Autor Luc Martens

23 feb 2014

Preț: 610^.18 lei 717^.86 lei

6-8 săpt.

-15%

Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications

Electronic Packaging and Interconnects, nr. 2

Autor Dean L. Monthei

14 mar 2014

Preț: 613^.62 lei 721^.90 lei

6-8 săpt.

-15%