Electronic Packaging and Interconnects

High-Frequency Characterization of Electronic Packaging

Electronic Packaging and Interconnects, nr. 1

Autor Luc Martens

31 oct 1998

Preț: 659^.55 lei 775^.95 lei

6-8 săpt.

-15%

Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications

Electronic Packaging and Interconnects, nr. 2

Autor Dean L. Monthei

14 mar 2014

Preț: 613^.62 lei 721^.90 lei

6-8 săpt.

-15%