Electrical Modeling and Design for 3D System Integration – 3D Integrated Circuits and Packaging Signal Integrity, Power Integrity and EMC
Autor EP Lien Limba Engleză Hardback – 18 apr 2012
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Specificații
ISBN-13: 9780470623466
ISBN-10: 0470623462
Pagini: 384
Dimensiuni: 158 x 240 x 31 mm
Greutate: 0.76 kg
Editura: Wiley
Locul publicării:Hoboken, United States
ISBN-10: 0470623462
Pagini: 384
Dimensiuni: 158 x 240 x 31 mm
Greutate: 0.76 kg
Editura: Wiley
Locul publicării:Hoboken, United States
Public țintă
Design engineers, researchers, postgraduates, postdoctoral researchers, university professors and consultants.Notă biografică
ER-PING LI, PhD, holds an appointment as Chair Professor at Zhejiang University, China, and has also been a principal scientist and director at the Institute of High Performance Computing, Singapore. He is a Fellow of the IEEE and a Fellow of the Electromagnetics Academy. He has received numerous awards and honors in recognition of his professional work from the IEEE and other professional bodies. Dr. Li is a pioneer in the modeling and simulation for signal/power and EMC in integrated circuits and electronic systems packaging. He has chaired or spoken at numerous international conferences and universities, and has also served as editor to several IEEE Transactions.
Descriere
The first book to address electromagnetic modeling methodologies for analysis of the large complex electronic structures, Efficient Electromagnetic Modeling for High Speed Electronics systematically reviews a series of fast and efficient electromagnetic modeling techniques.