Cantitate/Preț
Produs

Circuit Design on Plastic Foils: Analog Circuits and Signal Processing

Autor Daniele Raiteri, Eugenio Cantatore, Arthur van Roermund
en Limba Engleză Hardback – 15 dec 2014
This book illustrates a variety of circuit designs on plastic foils and provides all the information needed to undertake successful designs in large-area electronics. The authors demonstrate architectural, circuit, layout, and device solutions and explain the reasons and the creative process behind each. Readers will learn how to keep under control large-area technologies and achieve robust, reliable circuit designs that can face the challenges imposed by low-cost low-temperature high-throughput manufacturing.
Citește tot Restrânge

Din seria Analog Circuits and Signal Processing

Preț: 61687 lei

Preț vechi: 72573 lei
-15%

Puncte Express: 925

Carte tipărită la comandă

Livrare economică 01-15 iunie


Specificații

ISBN-13: 9783319114262
ISBN-10: 3319114263
Pagini: 140
Ilustrații: X, 130 p. 103 illus., 53 illus. in color.
Dimensiuni: 160 x 241 x 14 mm
Greutate: 0.38 kg
Ediția:2015
Editura: Springer
Colecția Analog Circuits and Signal Processing
Seria Analog Circuits and Signal Processing

Locul publicării:Cham, Switzerland

Public țintă

Research

Cuprins

Introduction.- Applications of large-area electronics on foils.- State of the art in circuit design.- Device modeling and characterization.- Sensor frontend architecture.- Circuit design for analog signal conditioning.- Circuit design for data conversion.- Circuit design for digital processing.- Conclusions.

Textul de pe ultima copertă

This book illustrates a variety of circuit designs on plastic foils and provides all the information needed to undertake successful designs in large-area electronics.  The authors demonstrate architectural, circuit, layout, and device solutions and explain the reasons and the creative process behind each. Readers will learn how to keep under control large-area technologies and achieve robust, reliable circuit designs that can face the challenges imposed by low-cost low-temperature high-throughput manufacturing.
 
• Discusses implications of problems associated with large-area electronics and compares them to standard silicon;
• Provides the basis for understanding physics and modeling of disordered material;
• Includes guidelines to quickly setup the basic CAD tools enabling efficient and reliable designs;
• Illustrates practical solutions to cope with hard/soft faults, variability, mismatch, aging and bias stress at architecture, circuit, layout, and device levels.