BSIM–SOI Industry-Standard Compact Model: Surface Potential-Based FET Model for RFIC Design: Woodhead Publishing Series in Electronic and Optical Materials
Autor Chetan Kumar Dabhi, Debashish Nandi, Dinesh Rajasekharan, Chenming Hu, Yogesh Singh Chauhan, Ananth Sundaramen Limba Engleză Paperback – noi 2026
This book will equip designers, engineers, and researchers with the knowledge and tools required to optimize SOI-based circuit performance and system integration. The book explains fundamental surface-potential calculations and addresses various real device effects, such as floating body, self-heating, dynamic depletion effects, and layout influences to accurately replicate realistic device behavior. Additionally, the step-by-step parameter extraction procedures for the BSIM-SOI model are outlined, and the results of benchmark tests are also presented.
- Serves as an invaluable and practical reference for comprehending the operational intricacies and underlying physics of SOI devices
- Comprehensively covers all facets of the BSIM-SOI model, offering insights directly from model developers themselves
- Offers detailed insights into, and solutions for, the challenges associated with extracting parameters from SOI devices due to factors such as conventional and gate-induced floating body effects, dynamic depletion effects, etc.
- Provides clear guidance (focusing primarily on the modeling process) on the measurement data needed to extract BSIM-SOI model parameters
- Discusses RF switch and power amplifier design, linking this to device parameters via physics-based simulation models
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Specificații
ISBN-13: 9780443439049
ISBN-10: 0443439044
Pagini: 350
Dimensiuni: 152 x 229 mm
Editura: ELSEVIER SCIENCE
Seria Woodhead Publishing Series in Electronic and Optical Materials
ISBN-10: 0443439044
Pagini: 350
Dimensiuni: 152 x 229 mm
Editura: ELSEVIER SCIENCE
Seria Woodhead Publishing Series in Electronic and Optical Materials
Cuprins
1. General overview of SOI models and technology trends
2. Core model formulation
3. Real device effects
4. Terminal charges and capacitances
5. Leakage currents
6. Noise models in BSIM-SOI
7. Body contact parasitics – modeling approach
8. Self-Heating and Temperature Effects
9. Cutting-Edge RF Modeling and Validation Techniques
10. Integrating BSIM-SOI Models in Analog, Digital, and RF Designs
11. Parameter Extraction
12. Model Quality testing
2. Core model formulation
3. Real device effects
4. Terminal charges and capacitances
5. Leakage currents
6. Noise models in BSIM-SOI
7. Body contact parasitics – modeling approach
8. Self-Heating and Temperature Effects
9. Cutting-Edge RF Modeling and Validation Techniques
10. Integrating BSIM-SOI Models in Analog, Digital, and RF Designs
11. Parameter Extraction
12. Model Quality testing