High Mobility Materials for CMOS Applications: Woodhead Publishing Series in Electronic and Optical Materials
Editat de Nadine Collaerten Limba Engleză Paperback – 20 iun 2018
- Addresses each of the challenges of utilizing high mobility materials for CMOS applications, presenting possible solutions and the latest innovations
- Covers the latest advances in research on heterogeneous integration, gate stack, device design and scalability
- Provides a broad overview of the topic, from materials integration to circuits
Din seria Woodhead Publishing Series in Electronic and Optical Materials
- 9%
Preț: 1191.03 lei - 27%
Preț: 1193.57 lei - 32%
Preț: 1020.82 lei - 9%
Preț: 977.94 lei - 32%
Preț: 1102.05 lei - 42%
Preț: 1168.66 lei - 36%
Preț: 1158.63 lei - 9%
Preț: 1496.07 lei - 32%
Preț: 981.87 lei - 20%
Preț: 1101.90 lei - 9%
Preț: 926.79 lei - 27%
Preț: 964.26 lei - 9%
Preț: 1313.02 lei - 9%
Preț: 1138.58 lei - 27%
Preț: 960.79 lei - 9%
Preț: 981.78 lei - 9%
Preț: 1183.25 lei - 9%
Preț: 985.86 lei - 27%
Preț: 1545.21 lei - 27%
Preț: 988.44 lei - 9%
Preț: 1107.64 lei - 27%
Preț: 1117.44 lei - 42%
Preț: 834.66 lei - 9%
Preț: 1373.50 lei - 9%
Preț: 1079.25 lei - 9%
Preț: 1485.24 lei - 9%
Preț: 1298.24 lei - 27%
Preț: 974.39 lei - 27%
Preț: 899.40 lei - 27%
Preț: 693.52 lei - 9%
Preț: 944.02 lei - 9%
Preț: 1041.47 lei - 9%
Preț: 922.99 lei - 35%
Preț: 981.44 lei - 9%
Preț: 984.80 lei - 32%
Preț: 1463.52 lei - 9%
Preț: 980.11 lei - 9%
Preț: 1251.10 lei - 32%
Preț: 1106.47 lei - 35%
Preț: 345.85 lei - 32%
Preț: 869.10 lei - 32%
Preț: 1371.55 lei - 27%
Preț: 978.03 lei - 9%
Preț: 1169.15 lei - 8%
Preț: 329.31 lei - 27%
Preț: 901.18 lei - 27%
Preț: 955.82 lei
Preț: 983.83 lei
Preț vechi: 1081.13 lei
-9%
Puncte Express: 1476
Preț estimativ în valută:
173.91€ • 205.95$ • 151.50£
173.91€ • 205.95$ • 151.50£
Carte tipărită la comandă
Livrare economică 26 martie-09 aprilie
Specificații
ISBN-13: 9780081020616
ISBN-10: 0081020619
Pagini: 384
Dimensiuni: 152 x 229 mm
Greutate: 0.52 kg
Editura: ELSEVIER SCIENCE
Seria Woodhead Publishing Series in Electronic and Optical Materials
ISBN-10: 0081020619
Pagini: 384
Dimensiuni: 152 x 229 mm
Greutate: 0.52 kg
Editura: ELSEVIER SCIENCE
Seria Woodhead Publishing Series in Electronic and Optical Materials
Public țintă
Materials scientist researchers and electronic engineers in research and designCuprins
1. CMOS and Beyond CMOS: Scaling Challenges2. Opportunities for high mobility materials integrated on a Si platform3. Monolithic integration of InGaAs on Si(001) substrate for Logic devices4. III-N epitaxy on Si for power electronics5. Impact of defects on the performance of high-mobility semiconductor devices6. (Si)Ge devices7. III-V Devices and Technology for CMOS8. Beyond CMOS9. Optoelectronic devices integrated on silicon10. High mobility devices for digital applications