Basics of Cutting and Abrasive Processes
Autor Hans Kurt Toenshoff, Berend Denkenaen Limba Engleză Paperback – 10 iul 2015
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Specificații
ISBN-13: 9783642447006
ISBN-10: 3642447007
Pagini: 416
Ilustrații: XIII, 399 p.
Dimensiuni: 155 x 235 x 23 mm
Greutate: 0.63 kg
Ediția:2013
Editura: Springer
Locul publicării:Berlin, Heidelberg, Germany
ISBN-10: 3642447007
Pagini: 416
Ilustrații: XIII, 399 p.
Dimensiuni: 155 x 235 x 23 mm
Greutate: 0.63 kg
Ediția:2013
Editura: Springer
Locul publicării:Berlin, Heidelberg, Germany
Public țintă
ResearchCuprins
Introduction to the technology of cutting and abrasive processes.- Chip formation.- Chip control.- Forces and powers in cutting and abrasive processes.- Energy conversion.- Modeling.- Wear.- Cutting materials.- High Speed Cutting.- Hard Cutting, Process Design.- Hard machining quality.- Broaching.- Grinding.- Gear grinding.- Process chain.- Surface.- Cooling lubrication.
Textul de pe ultima copertă
Manufacturing is the basic industrial activity generating real value. Cutting and abrasive technologies are the backbone of precision production in machine, automotive and aircraft building as well as of production of consumer goods. We present the knowledge of modern manufacturing in these technologies on the basis of scientific research. The theory of cutting and abrasive processes and the knowledge about their application in industrial practice are a prerequisite for the studies of manufacturing science and an important part of the curriculum of the master study in German mechanical engineering. The basis of this book is our lecture “Basics of cutting and abrasive processes” (4 semester hours/3 credit hours) at the Leibniz University Hannover, which we offer to the diploma and master students specializing in manufacturing science.
Caracteristici
Based on a lecture “Basics of cutting and abrasive processes” held at the Leibniz University Hannover, Germany Comprehensive research introduces the newest results in the relevant fields Written by renowned experts in the field Includes supplementary material: sn.pub/extras