Filtre: Engleză Springer

Cărți de Yong Liu

Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

13 apr 2014

Preț: 1497^.61 lei 1826^.36 lei

6-8 săpt.

-18%

Passive and Active Measurement

Computer Communication Networks and Telecommunications

Editat de Jelena Mirkovic et al.

25 mar 2015

Preț: 351^.33 lei 439^.16 lei

38-44 zile

-20%

Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications

Autor Shichun Qu et al.

11 sep 2014

Preț: 962^.87 lei 1174^.22 lei

6-8 săpt.

-18%