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VLSI Technology

Editat de Wai-Kai Chen
en Limba Engleză Hardback – 19 mar 2003
As their name implies, VLSI systems involve the integration of various component systems. While all of these components systems are rooted in semiconductor manufacturing, they involve a broad range of technologies. This volume of the Principles and Applications of Engineering series examines the technologies associated with VLSI systems, including VLSI processes, semiconductor technology, micromachining, microelectronics packaging, compound semiconductor digital ICs, and multichip modules. Highlights include discussions on relatively recent innovations and progress in areas such as SiGE, SiC, and SOI technologies, noise issues, materials, and logic design.
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Specificații

ISBN-13: 9780849317385
ISBN-10: 084931738X
Pagini: 398
Ilustrații: 100 b/w images
Dimensiuni: 178 x 254 x 26 mm
Greutate: 0.86 kg
Ediția:1
Editura: CRC Press
Colecția CRC Press

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Cuprins

As their name implies, VLSI systems involve the integration of various component systems. While all of these components systems are rooted in semiconductor manufacturing, they involve a broad range of technologies. This volume of the Principles and Applications of Engineering series examines the technologies associated with VLSI systems, including VLSI processes, semiconductor technology, micromachining, microelectronics packaging, compound semiconductor digital ICs, and multichip modules. Highlights include discussions on relatively recent innovations and progress in areas such as SiGE, SiC, and SOI technologies, noise issues, materials, and logic design.

Descriere

As their name implies, VLSI systems involve the integration of various component systems. While all of these components systems are rooted in semiconductor manufacturing, they involve a broad range of technologies. This volume of the Principles and Applications of Engineering series examines the technologies associated with VLSI systems, including VLSI processes, semiconductor technology, micromachining, microelectronics packaging, compound semiconductor digital ICs, and multichip modules. Highlights include discussions on relatively recent innovations and progress in areas such as SiGE, SiC, and SOI technologies, noise issues, materials, and logic design.