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U.S.-China Chip War: Techno-Geopolitics and Statecraft in Asia

Editat de Pak Nung Wong
en Limba Engleză Paperback – 16 feb 2027
This book offers lucid, straightforward, policy-relevant and methodologically rigorous analyses of the ongoing US–China chip war and the context-specific ways how East Asian and Southeast Asian smaller states devise their techno-hedging strategies. In midst of US–China global semiconductor supply chains decoupling and weaponization, it presents conceptual and policy insights with clarity on how Asian techno-hedging strategies work to mitigate risks and turbulence of great power decoupling to advance national techno-economic gains, and to enhance industrial-positional leverages in global supply chains. US–China Chip War offers original research content and policy insights on: • Historical and contemporary dynamics of such inter-state technology competitions as the ongoing US–China chip war. • Key features of and distinctions between the European Union’s semiconductor supply chain system and the East Asia chip-island chain system. • Lucid comprehensive elucidations of such complex concepts and ideas as techno-nationalism, structural neo-realism, and techno-hedging, etc. • Rich and methodologically informed empirical case studies of different techno-hedging strategies as adopted by the governments and their major tech firms of Japan, South Korea, Taiwan and the Association of Southeast Asian Nations.
This is essential reading for not just academics and researchers interested in the US–China tech wars, European and Asian semiconductor global supply chains, emerging technologies and global political economy, but also for government policymakers, policy economists, think tankers, business strategists, bankers and global financial analysts, who are primarily concerned about how critical science and technology policymaking and business/investment decisions should factor in great power politics, techno-geopolitics, national security, international political economy and global finance.
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Specificații

ISBN-13: 9781041411604
ISBN-10: 104141160X
Pagini: 328
Ilustrații: 34
Dimensiuni: 156 x 234 mm
Ediția:1
Editura: Taylor & Francis
Colecția Routledge
Locul publicării:Oxford, United Kingdom

Public țintă

General, Postgraduate, Professional Reference, and Undergraduate Advanced

Cuprins

PART I The U.S.-China Chip War;  1. Introduction: Contouring Great Power Techno-Geopolitics in European and Asian Rimland, 2. Deciphering the U.S.-China Chip War: Towards a Neorealist Practice of Techno-Geopolitics, 3. Towards Techno-Economic Hemispherization: China’s Quest for Technological Self-Reliance, Micron Ban, and Rare Earth Export Controls; PART II Techno-Hedging in Asia, 4. Japan: Reshaping Traditional Hedging Boundaries through Advanced Technology, 5. South Korea: Enhancing Industrial R&D Capacity for Achieving Memory Chip Global Leadership, 6. Taiwan: Building High-End Techno-Economic Capacity for Preserving Cross-Strait Status Quo, 7. ASEAN: Vietnam, Malaysia, and Singapore’s Techno-Hedging Strategies in Navigating U.S.-China Chip War PART III Way Forward for ASEAN, 8. Beyond Neutral: How Technology Shapes Power, 9. Hegemonic Load and Techno-Hedging: A Framework for Secondary-State Technology Strategy in Great-Power Competition, 10. Neither Washington nor Beijing: Techno-Hedging and Digital Infrastructure Choices in Southeast Asia, 11. Conclusion

Notă biografică

Pak Nung Wong (D.Phil Oxon) teaches politics and international relations at the University of Bath, U.K. His recent books include Decolonizing Global Intelligence: Emerging Intelligence Trends and the Practice of Inclusive Statecraft (2026). He is founder and Editor-in-Chief of Bandung: Journal of the Global South.

Descriere

This book offers lucid, straightforward, policy-relevant and methodologically rigorous analyses of the ongoing US–China chip war and the context-specific ways how East Asian and Southeast Asian smaller states devise their techno-hedging strategies.