Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
Autor Shuye Zhang, Guoli Sunen Limba Engleză Hardback – iul 2025
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Specificații
ISBN-13: 9781837241408
ISBN-10: 1837241406
Pagini: 199
Dimensiuni: 156 x 234 x 13 mm
Greutate: 0.46 kg
Editura: Institution of Engineering and Technology
ISBN-10: 1837241406
Pagini: 199
Dimensiuni: 156 x 234 x 13 mm
Greutate: 0.46 kg
Editura: Institution of Engineering and Technology
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