Microelectronics Packaging Handbook: Subsystem Packaging Part III
Autor R.R. Tummala et al.
30 ian 1997
Hardback
Preț: 968.77 lei 1210.97 lei
43-57 zile
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R.R. Tummala
Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging
Autor R.R. Tummala et al.
30 ian 1997
Carte
Preț: 1452.12 lei 1815.16 lei
Indisponibil temporar
-20%