Particles on Surfaces 3
Editat de K L Mittalen Limba Engleză Hardback – 31 mar 1992
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Specificații
ISBN-13: 9780306441806
ISBN-10: 0306441802
Pagini: 328
Ilustrații: VIII, 328 p.
Dimensiuni: 178 x 254 x 21 mm
Greutate: 0.81 kg
Ediția:1991 edition
Editura: Springer Us
Locul publicării:New York, NY, United States
ISBN-10: 0306441802
Pagini: 328
Ilustrații: VIII, 328 p.
Dimensiuni: 178 x 254 x 21 mm
Greutate: 0.81 kg
Ediția:1991 edition
Editura: Springer Us
Locul publicării:New York, NY, United States
Public țintă
ResearchCuprins
I. Particle-Surface Interactions, Adhesion and General Papers.- Relevance of Surface Energetics to Departiculation of Disk Drive Substrates.- Particle Adhesion to Surface Under Turbulent Flow Conditions.- Modelling Particle Accumulation on a Filter Surface.- Particles in ULSI Grade Chemicals and Their Adhesion to Silicon Surfaces.- Evaluation of Polymeric Materials Used in the Manufacture of Disk Handling Cassettes.- The Release of Particles During Spaceflight.- II. Particle detection, identification, analysis and characterization.- Statistical Aspects of Surface Particle Counting.- Light Scattering by Submicron Spherical Particles on Semiconductor Surfaces.- BRDF Measurements and Mie Scattering Analysis of Spherical Particles on Optical Surfaces.- Identification of Surface Contaminants Using Infrared Micro-profiling.- Analysis of Particles on Surfaces by Total Reflection X-ray Fluorescence Spectrometry.- Characterization of Surface Metal Particulate Contamination Using the Polysilicon Chemical Vapor Deposition Process.- Detection and Subsequent Reduction of Surface Particle Induced Defects on Silicon Wafers.- Isolation and Characterization of Particle Induced Defects from the Lithography Process Using an Electrical Defect Monitor.- III. Particle Reduction and Removal.- Reducing Uncertainties in Particle Adhesion and Removal Measurements.- Particulate and Defect Reduction Strategies for Semiconductor Devices: Tools and Methodologies.- Ultrasonic Cleaning of Surfaces: An Overview.- Particle Protection of Semiconductor Surfaces by Reversible Wafer Bonding and Related Concepts.- Ultra-Clean Air Ionizers for Suppression of Particulate Surface Contamination.- The Cold Jet Process — An Environmentally Sound Alternative for Particles Removal From Advanced Substrates.-Identification and Removal of Storage Induced Particle Contamination on Silicon Wafer Surfaces.- Particle Removal from Oxide, Nitride, and Bare Silicon Surfaces Using Direct-Displacement Isopropyl Alcohol (IPA) Drying.- Elimination of Fretting Wear Particles from the Surface of a Power Cable on a Disk Drive Actuator: A Case Study.- Scanning UV Laser Removal of Contaminants from Semiconductor and Optical Surfaces.- About the Contributors.