Particles on Surfaces 1: Detection, Adhesion, and Removal
Editat de K.L. Mittalen Limba Engleză Paperback – 19 feb 2012
Preț: 384.33 lei
Puncte Express: 576
Carte tipărită la comandă
Livrare economică 10-24 august
Livrare prin curier în România Termenul estimat este afișat lângă disponibilitate.
Transport gratuit de la 400.00 lei Plată online sau ramburs, în funcție de opțiunile comenzii.
Retur gratuit în 14 zile Comandă securizată și suport în română.
Specificații
ISBN-13: 9781461595335
ISBN-10: 1461595339
Pagini: 396
Ilustrații: X, 384 p.
Dimensiuni: 178 x 254 x 21 mm
Greutate: 0.69 kg
Ediția:1988
Editura: Springer Us
Colecția Springer
Locul publicării:New York, NY, United States
ISBN-10: 1461595339
Pagini: 396
Ilustrații: X, 384 p.
Dimensiuni: 178 x 254 x 21 mm
Greutate: 0.69 kg
Ediția:1988
Editura: Springer Us
Colecția Springer
Locul publicării:New York, NY, United States
Public țintă
ResearchCuprins
I. General Papers.- Fine Particles on Semiconductor Surfaces: Sources, Removal and Impact on the Semiconductor Industry.- Cleaning Semiconductor Surfaces: Facts and Foibles.- Effect of Chemical Cleaning Sequencing on Particle Addition/Reduction on Silicon Wafers.- Measuring Aerosol Particle Concentration in Clean Rooms and Particle Areal Density on Silicon Wafer Surfaces.- Particulate Contamination on Wafer Surfaces Resulting From Hexamethyldisilazane/Water Interactions.- Contamination of Chip Surfaces by Particles During Destructive Physical Analysis of Integrated Circuit Devices.- Calculation of Hamaker Coefficients for Metallic Aerosols from Extensive Optical Data.- Soiling Mechanisms and Performance of Anti-Soiling Surface Coatings.- Implications of Particulate Contamination in the Performance of Floppy Disks.- II. Particle-Substrate Interaction and Particle Adhesion.- A Theoretical Review of Particle Adhesion.- The Electrostatic Force on a Dielectric Sphere Resting on a Conducting Substrate.- Electrostatic Charge Generation on Wafer Surfaces and Its Effect on Particulate Deposition.- Toner Adhesion in Electrophotography.- Adhesion and Removal of Particles: Effect of Medium.- Strong Adhesion of Dust Particles.- Prevention of Strong Adhesion of Dust Particles.- Dynamic Adhesion of Particles Impacting a Cylinder.- Crossed Fiber Models of the Particle-Surface Interaction.- Sensitive New Method for the Determination of Adhesion Force Between a Particle and a Substrate.- III. Particle Detection, Analysis and Characterization.- Detection of Particles on Clean Surfaces.- Detection of Particles Down to a “Few” Micrometers on Non-Specular Microelectronic Substrates and Other Surfaces.- Accurate Particle Counting for Bare Substrate Inspection.- Automated SEM/EDS ImageAnalysis of Particles on Filter Blanks.- Particle Sizing and Counting with the Inspex EX20/20.- IV. Particle Removal.- Methods for Surface Particle Removal: A Comparative Study.- Electrostatic Removal of Particles from Surfaces.- Electric Field Detachment of Charged Particles.- A New Approach to the Removal of Sub-Micron Particles From Solid (Silicon) Substrates.- About the Contributors.