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Multidimensional Signal Processing: Methods and Applications de Roumen Kountchev

Multidimensional Signal Processing: Methods and Applications

Editat de Roumen Kountchev, Srikanta Patnaik, Yingkai Liu, Roumiana Kountcheva
en Limba Engleză Hardback – 13 dec 2024

Găsim în această lucrare, publicată în 2024 de Springer, o resursă tehnică de ultimă oră care acoperă cele mai noi metodologii în procesarea semnalelor multidimensionale, cu un focus special pe integrarea Deep Learning și a tehnologiei Digital Twin. Suntem de părere că acest volum este esențial pentru înțelegerea modului în care reprezentările tensoriale avansate și algoritmii de optimizare transformă analiza datelor 3D complexe. Dacă 3D Imaging-Multidimensional Signal Processing and Deep Learning de Srikanta Patnaik v-a oferit cadrul teoretic și fundamentele edițiilor anterioare, această carte oferă instrumentele practice și studiile de caz necesare pentru implementarea soluțiilor în medii de operare dinamice. Structura volumului este riguros organizată, pornind de la baze matematice precum descompunerea IDP Tensor și progresând către aplicații industriale și de consum. Putem afirma că selecția de lucrări acoperă un spectru larg, de la îmbunătățirea sumarizării abstractive prin modele graf-secvență, până la utilizarea realității augmentate în designul de produs. Această abordare pragmatică poziționează volumul ca o continuare firească a preocupărilor editorilor Roumen Kountchev și Srikanta Patnaik regăsite în AI Technologies and Virtual Reality, însă cu un accent mult mai pronunțat pe eficiența computațională și pe procesarea în timp real a imaginilor multidimensionale. Tonul este unul strict academic și tehnic, oferind specificații concrete pentru cercetătorii care doresc să exploreze intersecția dintre procesarea de semnal și viziunea computerizată modernă.

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Specificații

ISBN-13: 9789819751808
ISBN-10: 9819751802
Pagini: 420
Ilustrații: X, 340 p. 50 illus.
Dimensiuni: 160 x 241 x 27 mm
Greutate: 0.87 kg
Ediția:2024
Editura: Springer
Locul publicării:Singapore, Singapore

De ce să citești această carte

Pentru inginerii și cercetătorii din domeniul procesării de imagine, acest volum oferă o perspectivă tehnică asupra celor mai recente inovații în tehnologia 3D și inteligența artificială. Veți câștiga acces la metode avansate de compresie a datelor prin tensori și soluții de implementare pentru sisteme Digital Twin, fiind un instrument indispensabil pentru cei care dezvoltă aplicații de realitate augmentată sau sisteme de monitorizare bazate pe Deep Learning în medii complexe.

Despre autor

Roumen Kountchev a fost un profesor și cercetător marcant la Universitatea Tehnică din Sofia, Bulgaria, fiind recunoscut la nivel internațional pentru contribuțiile sale în procesarea imaginilor multidimensionale și sistemele video. Srikanta Patnaik este un expert consacrat în inteligență artificială și robotică, având o vastă experiență în editarea lucrărilor de conferință de înalt nivel. Împreună cu echipa editorială, aceștia au coordonat numeroase volume publicate de Springer, precum Advances in Computational Vision and Robotics, consolidând o platformă globală pentru schimbul de idei în domeniul informaticii avansate și al tehnologiilor 3D.

Descriere scurtă

This book presents high-quality research in the field of 3D imaging technology. The fifth edition of International Conference on 3D Imaging Technology (3DDIT-MSP&DL) continues the good traditions already established by the first four editions of the conference to provide a wide scientific forum for researchers, academia, and practitioners to exchange newest ideas and recent achievements in all aspects of image processing and analysis, together with their contemporary applications. The conference proceedings are published in two volumes. The main topics of the papers comprise famous trends such as: 3D image representation, 3D image technology, 3D images and graphics, and computing and 3D information technology. In these proceedings, special attention is paid at the 3D tensor image representation, the 3D content generation technologies, big data analysis, and also deep learning, artificial intelligence, the 3D image analysis and video understanding, the 3D virtual and augmented reality, and many related areas. The first volume contains papers in 3D image processing, transforms, and technologies. The second volume is about computing and information technologies, computer images, and graphics and related applications. The two volumes of the book cover a wide area of the aspects of the contemporary multidimensional imaging and the related future trends from data acquisition to real-world applications based on various techniques and theoretical approaches.

Cuprins

1. Evaluation of Ultrasonic Doppler Signal Quality Based on Deep Learning.- 2. Tensor Compression Based on Tensor Train Decomposition.- 3. Digital Twin Technology Approach Based on the Hierarchical IDP Tensor Decomposition.- 4. Modeling Technology for Complex Dynamic Operating Environment of Power Grid Based on Digital Twins.- 5. Design of a Digital Twin Platform Based on Distributed Computing and Resource Optimization Algorithms.- 6. Deep Learning Network Optimization Combining 3D Imaging and Multidimensional Signal Processing.- 7. Time Series Prediction Application of Deep Learning in Multidimensional Signal Processing.- 8. Improving of Abstractive Summarization with Graph Sequence Model.- 9. Advancing Semantic Segmentation and Interpretation of 3D Images through Integrated Deep Learning and Natural Language Processing Techniques.- 10. Children's Toy Product Design Based on Augmented Reality Technology.

Notă biografică

Roumen Kountchev, Ph.D., D. Sc., is a professor at the Faculty of Telecommunications, Department of Radio Communications and Video Technologies at the Technical University of Sofia, Bulgaria. His scientific areas of interest are: digital signal and image processing, image compression, multimedia watermarking, video communications, pattern recognition, and neural networks. Prof. Kountchev has 450 papers published in magazines and conference proceedings; 20 books; 48 book chapters; and 20 patents. At present, he is a member of Euro Mediterranean Academy of Arts and Sciences and the president of the Bulgarian Association for Pattern Recognition (member of IAPR). He has been a plenary speaker at more than 30 international scientific conferences and symposia and edited several books published in Springer SIST series and was co-editor of Special issues for Symmetry MDPI.
Prof. Srikanta Patnaik is presently working as director of Interscience Institute of Management & Technology,Bhubaneswar, India. He has received his Ph. D. (Engineering) on Computational Intelligence from Jadavpur University, India in 1999. He has  supervised 32 Ph. D. Theses and more than 60 Master theses in the area of Computational Intelligence, Soft Computing Applications and Re-Engineering. Dr. Patnaik has published more than 100 research papers in international journals and conference proceedings. He is author of 3 text books and more than 100 edited volumes and few invited book chapters, published by leading international publisher like IEEE, ACM, Elsevier, Springer-Verlag, Kluwer Academic, SPIE, IOS Press and others. Dr. Patnaik is the Editor-in-Chief of International Journal of Information and Communication Technology and International Journal of Computational Vision and Robotics published by Inderscience Publishing House, England and also Editor-in-chief of Book Series on “Modeling and Optimization in Science and Technology” published by Springer, Germany. He is the Editor ofJournal of Information and Communication Convergence Engineering, published by Korean Institute of Information and Communication Convergence Engineering. Prof. Patnaik is a Guest Professor to Hunan University of Finance and Economics, Changsha and Kunming University of Science and Technology, Kunming, China and visiting professors to some of the B-Schools  of Europe and South East Asia. He is a member of Institute of Electrical and Electronics Engineering (IEEE) and Association for Computing Machinery (ACM). He is also Fellow of IETE, Life Member of ISTE, and CSI. Dr. Patnaik has visited various countries such as Japan, China, Hong Kong, Singapore, Indonesia, Iran, Malaysia, Philippines, South Korea, United Arab Emirates, Morocco, Algeria, Thailand and Vietnam for delivering Key note addresses at various conferences and symposiums.

Yingkai Liu is the dean of the Institute of Physics and Electronic Information at Yunnan Normal University. He obtained his M.S. degree in condensed matter physics from Yunnan University in 1998 and PhD in condensed matter physics in 2002 from Nanjing University. He then did his postdoctoral research in the Center of Super-Diamond and Advanced Films (COSDAF) at City University of Hong Kong before joining Yunnan Normal University. He visited City University of Hong Kong from Sep. to Jun 2019 and Rice University from February to December 2018. His research interests include nanomaterial synthesis and characterization, and nanodevice fabrication for photodetectors, gas sensors, environment, and biomedical applications. Up to now, he has published 78 articles in the world-famous journals such as Advanced Materials, Advanced Optical Materials, Sensors and Actuators B, Applied Physics Letters, and Nanomaterials, etc. His papers were cited 1800 times by other people.Roumiana Kountcheva got her M.Sc. and Ph.D. at the Technical University of Sofia, Bulgaria, and in 1992, she got the title Senior Researcher. At present, she is the vice-president of TK Engineering, Sofia. She had postgraduate trainings in Fujitsu and Fanuc, Japan. Her main scientific interests are in image processing, image compression, digital watermarking, pattern recognition, image tensor representation, neural networks, CNC, and programmable controllers. She has more than 200 publications and 5 international patents (EU and USA). R. Kountcheva was the plenary speaker at 23 international scientific conferences and scientific events. She edited several books published in Springer SIST series and is a co-editor of Special issues for Symmetry MDPI.

Caracteristici

Features the outcomes of 3DDIT 2023, held in Kunming, China, during December 2023 Presents high-quality research in the field of 3D imaging technology Serves as a reference resource for researchers and practitioners in academia and industry