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Laser Technology

Editat de K L Mittal, Wei-Sheng Lei
en Limba Engleză Hardback – 28 feb 2018
The acronym Laser is derived from Light Amplification by Stimulated Emission of Radiation. With the advent of the ruby laser in 1960, there has been tremendous research activity in developing novel, more versatile and more efficient laser sources or devices, as lasers applications are ubiquitous. Today, lasers are used in many areas of human endeavor and are routinely employed in a host of diverse fields: various branches of engineering, microelectronics, biomedical, medicine, dentistry, surgery, surface modification, to name just a few.
In this book (containing 10 chapters) we have focused on application of lasers in adhesion and related areas. The topics covered include:
  • Topographical modification of polymers and metals by laser ablation to create superhydrophobic surfaces.
  • Non-ablative laser surface modification.
  • Laser surface modification to enhance adhesion.
  • Laser surface engineering of materials to modulate their wetting behavior.
  • Laser surface modification in dentistry.
  • Laser polymer welding.
  • Laser based adhesion testing technique to measure thin film-substrate interface toughness.
  • Laser surface removal of hard thin ceramic coatings.
  • Laser removal of particles from surfaces.
  • Laser induced thin film debonding for micro-device fabrication applications.
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Specificații

ISBN-13: 9781119184935
ISBN-10: 1119184932
Pagini: 448
Dimensiuni: 157 x 235 x 28 mm
Greutate: 0.79 kg
Editura: Wiley
Locul publicării:Hoboken, United States

Public țintă

This unique book should be of great interest to those in materials science, chemistry, physics and engineering. The information consolidated in this book should be of much value and relevance to R&D personnel engaged in adhesion and adhesive bonding, surface modification (both physical and chemical) for a legion of applications, polymer welding, cleaning, dentistry, device fabrication, micro and nanostructures formation, and unravelling thin film/substrate adhesion behavior.