Laser Processing and Analysis of Materials
Autor Walter W. Duleyen Limba Engleză Paperback – 14 iun 2012
Preț: 385.96 lei
Puncte Express: 579
Carte tipărită la comandă
Livrare economică 12-26 august
Livrare prin curier în România Termenul estimat este afișat lângă disponibilitate.
Transport gratuit de la 400.00 lei Plată online sau ramburs, în funcție de opțiunile comenzii.
Retur gratuit în 14 zile Comandă securizată și suport în română.
Specificații
ISBN-13: 9781475701951
ISBN-10: 1475701950
Pagini: 480
Ilustrații: XIV, 464 p. 86 illus.
Dimensiuni: 152 x 229 x 26 mm
Greutate: 0.69 kg
Ediția:Softcover reprint of the original 1st ed. 1983
Editura: Springer
Locul publicării:New York, NY, United States
ISBN-10: 1475701950
Pagini: 480
Ilustrații: XIV, 464 p. 86 illus.
Dimensiuni: 152 x 229 x 26 mm
Greutate: 0.69 kg
Ediția:Softcover reprint of the original 1st ed. 1983
Editura: Springer
Locul publicării:New York, NY, United States
Public țintă
ResearchCuprins
1 Lasers and Laser Radiation.- 1.1. Introduction.- 1.2. Laser Sources.- 1.3. Laser Radiation.- 1.4. Lens Aberrations.- 1.5. Window Materials.- 1.6. Mirrors and Polarizers.- 1.7. Q-Switching.- 1.8. Frequency Conversion.- 1.9. Mode Locking.- 1.10. Detectors and Power Meters.- 2. Materials Processing.- 2.1. Absorption of Laser Radiation by Metals.- 2.2. Absorption of Laser Radiation by Semiconductors and Insulators.- 2.3. Thermal Constants.- 2.4. Laser Drilling: Heat Transfer.- 2.5. Welding.- 2.6. Cutting.- 2.7. Micromachining.- 2.8. Surface Hardening.- 2.9. Surface Melting, Alloying, and Cladding.- 2.10. Surface Cleaning.- 2.11. Crystal Growth.- 2.12. Optical Fiber Splicing.- 2.13. Laser Deposition of Thin Films.- 3 Laser Processing of Semiconductors.- 3.1. Introduction.- 3.2. Annealing.- 3.3. Annealing—CW Lasers.- 3.4. Recrystallization.- 3.5. Silicide Formation.- 3.6. Ohmic Contacts and Junction Formation.- 3.7. Device Fabrication.- 3.8. Electrical Connections on Integrated Circuits.- 3.9. Monolithic Displays.- 4 Chemical Processing.- 4.1. Introduction.- 4.2. Schemes for Laser Isotope Separation.- 4.3. The Enrichment Factor.- 4.4. Laser-Induced Reaction.- 4.5. Single-Photon Predissociation.- 4.6. Two-Photon Dissociation.- 4.7. Photoisomerization.- 4.8. Two-Step Photoionization.- 4.9. Photodeflection.- 4.10. Multiphoton Dissociation.- 4.11. Selective Raman Excitation.- 4.12. Economics of Laser Isotope Separation.- 4.13. Laser-Induced Reactions.- 4.14. Isomerization.- 4.15. Lasers in Catalysis.- 4.16. Laser-Induced Reactions: UV-VIS Excitation.- 4.17. Processing via Thermal Heating.- 4.18. Polymerization.- 5 Lasers in Chemical Analysis.- 5.1. Introduction.- 5.2. Absorption Spectroscopy.- 5.3. Laser-Induced Fluorescence.- 5.4. Laser-Enhanced Ionization Spectroscopy.-5.5. Multiphoton Ionization.- 5.6. Raman Spectroscopy.- 5.7. Laser Magnetic Resonance.- 5.8. Laser Photoacoustic Spectroscopy.- 5.9. Laser Microprobe.- 5.10. Atomic Absorption Spectrometry.- 5.11. Laser Microprobe Mass Spectrometer.- 5.12. Laser Raman Microprobe.- 5.13. Lasers in Chromatography.- 6 Lasers in Environmental Analysis.- 6.1. Propagation of Laser Radiation through the Atmosphere.- 6.2. Laser Remote Sensing of the Atmosphere.- 6.3. Laser Sampling of Aerosols.- 6.4. Laser Remote Sensing of Water Quality.- References.- Materials Index.