Flexible Electronics
Autor Yongan Huang, Yewang Su, Shan Jiangen Limba Engleză Hardback – 2 ian 2023
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Specificații
ISBN-13: 9789811966224
ISBN-10: 9811966222
Pagini: 432
Ilustrații: XVII, 412 p. 241 illus., 229 illus. in color.
Dimensiuni: 160 x 241 x 28 mm
Greutate: 0.84 kg
Ediția:1st ed. 2022
Editura: Springer
Locul publicării:Singapore, Singapore
ISBN-10: 9811966222
Pagini: 432
Ilustrații: XVII, 412 p. 241 illus., 229 illus. in color.
Dimensiuni: 160 x 241 x 28 mm
Greutate: 0.84 kg
Ediția:1st ed. 2022
Editura: Springer
Locul publicării:Singapore, Singapore
Cuprins
Chapter 1. Introduction of flexible electronics.- Chapter 2. Buckling of film-on-substrate.- Chapter 3. Buckling of fibers-on-substrate.- Chapter 4. Self-similar design without substrate.- Chapter 5. Self-similar design with substrate.- Chapter 6. Conformal design with rigid substrate.- Chapter 7. Conformal design with soft substrate.- Chapter 8. Deformation instability under compression.- Chapter 9. Deformation instability under stretching.- Chapter 10. Multiple neutral layer design for flexible electronics.- Chapter 11. Liquid metal for stretchable electronics.- Chapter 12. Devices and applications of flexible electronics.
Notă biografică
YongAn Huang received the B.S. and M.S. degrees in Civil Engineering and the Ph.D. degree in Engineering Mechanics from Northwestern Polytechnical University, Xi'an, China, in 2001, 2004, and 2007, respectively. He was a Postdoctoral Fellow with the School of Mechanical Science and Engineering, Huazhong University of Science and Technology, (HUST), Wuhan, China, in 2007. He is currently a Professor of the State Key Laboratory of Digital Manufacturing Equipment and Technology, HUST. His current research interests include flexible electronics manufacturing and advanced material. Dr. Huang was awarded the Young Top-Notch Talent of "Ten Thousand Talent Program" of China in 2014. He was appointed as the Changjiang Young Scholar from Ministry of Education of China in 2016. He received the National Science Fund for Excellent Young Scholars of China.
Zhouping Yin received the B.S. and Ph.D. degrees in mechanical engineering from Huazhong University of Science and Technology (HUST), Wuhan, China, in 1994 and 2000, respectively. He is a Distinguished Professor and has been the Vice Head of the State Key Laboratory of Digital Manufacturing Equipment and Technology, HUST, since 2005. He is a Principal Investigator for projects sponsored by the General Program and Major Program of the National Science Foundation and the National Basic Research Project of China. He is leading a research group and conducting research in the electronic manufacturing equipment and technology, including printed electronics and radio frequency identification packaging. Dr. Yin was appointed as the Changjiang Distinguished Professor from Ministry of Education of China in 2009. He received the National Science Fund for Distinguished Young Scholars of China. Xiaodong Wan received his B.S. and Ph.D. degrees in engineering mechanics from Huazhong University of Science and Technology (HUST), Wuhan, China, in 2012 and 2016, respectively. He is currently a Postdoctoral Fellow at the School of Mechanical Science and Engineering, HUST. His research interests include flexible electronics manufacturing and laser processing. Dr. Wan received the Young Scientists Fund of the National Natural Science Foundation of China.
Textul de pe ultima copertă
Flexible electronics are electronics that can be stretched, bent, twisted, and deformed into arbitrary shapes. They break through the bottleneck and monopoly of traditional, rigid IC technologies and represent the next-generation electronics. This book provides an overview of the underlying theory and method of structural design for flexible electronics. Compared to intrinsically flexible and stretchable materials, structural engineering has proven its unique advantages, e.g. stretchable inorganic electronics. Based on the mechanical mechanisms, this book discusses the main structural deformation behaviors of flexible electronics, including mechanics of film-on-substrate and fiber-on-substrate, self-similar design with/without substrate, conformal design on rigid/soft substrate, purely in-plane design of serpentine interconnect with/without substrate, buckling-driven self-assembly and kirigami assembly strategies, neutral layer design, and the new materials-based structure design like liquid metals, etc. Moreover, the related advanced fabrication technology, the devices designs and applications of flexible electronics are also presented. The comprehensive and in-depth content makes this book can be used as a reference book for experienced researchers, as well as a teaching material for graduate students.
Caracteristici
Provides a comprehensive and in-depth mechanical analysis of deformation behaviors of flexible electronics
Illustrates the original academic ideas condensed from the authors’ fruitful research achievements
Presents guidelines for the designs and applications of next-generation flexible electronics
Illustrates the original academic ideas condensed from the authors’ fruitful research achievements
Presents guidelines for the designs and applications of next-generation flexible electronics