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Electronic Packaging and Interconnects

High-Frequency Characterization of Electronic Packaging

Electronic Packaging and Interconnects, nr. 1

Autor Luc Martens

31 oct 1998

Preț: 614^.24 lei 722^.63 lei

6-8 săpt.

-15%

Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications

Electronic Packaging and Interconnects, nr. 2

Autor Dean L. Monthei

30 noi 1998

Preț: 619^.61 lei 728^.96 lei

6-8 săpt.

-15%