Chiplet Design and Heterogeneous Integration Packaging
Autor John H. Lauen Limba Engleză Hardback – 28 mar 2023
Preț: 1091.81 lei
Preț vechi: 1417.94 lei
-23%
Puncte Express: 1638
Carte tipărită la comandă
Livrare economică 26 noiembrie-02 decembrie
Livrare prin curier în România Termenul estimat este afișat lângă disponibilitate.
Transport gratuit pentru acest produs Plată online sau ramburs, în funcție de opțiunile comenzii.
Retur gratuit în 14 zile Comandă securizată și suport în română.
Specificații
ISBN-13: 9789811999161
ISBN-10: 9811999163
Pagini: 548
Ilustrații: XXII, 525 p. 543 illus., 501 illus. in color.
Dimensiuni: 160 x 241 x 33 mm
Greutate: 1.03 kg
Ediția:2023
Editura: Springer
Locul publicării:Singapore, Singapore
ISBN-10: 9811999163
Pagini: 548
Ilustrații: XXII, 525 p. 543 illus., 501 illus. in color.
Dimensiuni: 160 x 241 x 33 mm
Greutate: 1.03 kg
Ediția:2023
Editura: Springer
Locul publicării:Singapore, Singapore
Cuprins
State-of-the-Art of Advanced Packaging.- Chip Partition and Chip Split.- Multiple System and Heterogeneous Integration with TSV Interposers.- Multiple System and Heterogeneous Integration with TSV-Less Interposers.- Chiplets Lateral (Horizontal) Communications.- Cu-Cu Hybrid Bonding.
Notă biografică
John H. Lau, Ph.D., P.E., from July 2019 to June 2021, was the CTO of Unimicron, Taoyuan, Taiwan, where he has been a Senior Special Project Assistant since July 2021. Prior to that, he was a Senior Scientist/MTS with the Hewlett-Packard Laboratory and Agilent, Palo Alto, CA, USA, for 20 years; the Director of the System Packaging Laboratory, Institute of Microelectronics, Singapore, for two years; a Visiting Professor with The Hong Kong University of Science and Technology, Hong Kong, for one year; a Specialist with the Industrial Technology Research Institute, Hsinchu, Taiwan, for five year; a senior technical advisor at ASM Pacific Technology in Hong Kong for five years. He earned a Ph.D. degree in theoretical and applied mechanics from the University of Illinois at Urbana-Champaign. With more than 40 years of R&D and manufacturing experience, he has authored or coauthored more than 530 peer-reviewed technical publications (385 are the principalinvestigator), invented more than 52 issued or pending US patents (31 are the principal inventor), and given more than 350 lectures/workshops/keynotes worldwide. He has authored or coauthored 23 textbooks on fan-out wafer-level packaging, 3D IC heterogeneous integration and packaging, TSV for 3D integration, advanced MEMS packaging, chiplet design and heterogeneous integrated packaging, reliability of 2D and 3D IC interconnects, flip chip, WLP, MCM, area-array packages, WLCSP, high-density PCB, SMT, DCA, TAB, lead-free materials, soldering, manufacturing, and solder joint reliability.
Textul de pe ultima copertă
The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Caracteristici
Addresses chiplet design and heterogeneous integraton packaging both in theory and practice Provides studies in design, materials, process, fabrication, and reliability of various chiplet designs Written by a veteran in the area