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Ceramic Transactions Volume 219

Editat de Kevin G Ewsuk, Makio Naito, Tomoyuki Kakeshita, Soshu Kirihara, Keizo Uematsu, Hiroya Abe
en Limba Engleză Hardback – 2 aug 2010
This proceedings volume features 59 peer-reviewed papers from ICCCI2009 on interface characterization and control technology, powder and composite processing, joining, the control of airborne particulates, new metallic glasses, and interface phenomena at high temperature. ICCCI2009 was supported by the Global COE Program "Center of Excellence for Advanced Structural and Functional Materials Design" lead by Professor Tomoyuki Kakeshita at Osaka University, the Project on Joining Technology for New Metallic Glasses and Inorganic Materials, the Institute of Materials Research (IMR) of Tohoku University, the Materials and Structures Laboratory (MSL) of the Tokyo Institute of Technology, Kobe Gakuin University, Hosokawa Powder Technology Foundation, the Japan JSPS 124th Committee, and the Joining and Welding Research Institute (JWRI) of Osaka University. Over 160 scientists and engineers from academia and industry from 18 different countries attended ICCCI2009 to see and discuss 140 invited and contributed presentations and posters on the state-of-the-art of interface characterization and control for particulate materials, joining, and nanotechnology.
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Specificații

ISBN-13: 9780470909171
ISBN-10: 047090917X
Pagini: 418
Dimensiuni: 161 x 240 x 27 mm
Greutate: 0.68 kg
Ediția:Volume 219
Editura: Wiley
Locul publicării:Hoboken, United States

Public țintă

Government labs, academics in mechanical/chemical engineering, materials/ceramics and chemistry departments, associations with related topical divisions or training courses (ASME, IEEE, SAE, AIChE), chemical and engineering libraries

Descriere

This proceedings volume features 59 peer-reviewed papers from ICCCI2009 on interface characterization and control technology, powder and composite processing, joining, the control of airborne particulates, new metallic glasses, and interface phenomena at high temperature.