3D Integration for Noc-Based Soc Architectures de Abbas Sheibanyrad

3D Integration for Noc-Based Soc Architectures

Abbas Sheibanyrad

Frédéric Pétrot

Axel Jantsch

This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.

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Paperback (1)	669^.59 lei 6-8 săpt.
Springer – 27 dec 2012	669^.59 lei 6-8 săpt.
Hardback (1)	911^.62 lei 6-8 săpt.
Springer – 10 dec 2010	911^.62 lei 6-8 săpt.

Cuprins

Three-Dimensional Integration of Integrated Circuits - an Introduction.- The Promises and Limitation of 3-D Integration.- Testing 3D Stacked ICs Containing Through-Silicon Vias.- Design and Computer Aided Design of 3DIC.- Physical Analysis of NoC Topologies for 3-D Integrated Systems.- Three-Dimensional Networks-on-Chip: Performance Evaluation.- Asynchronous 3D-NoCs.- Design of Application-Specific 3D Networks-on-Chip Architectures.- 3D Network on Chip Topology Synthesis: Designing Custom Topologies for Chip Stacks.- 3-D NoC on Inductive Wireless Interconnect.- Influence of Stacked 3D Memory/Cache architectures on GPUs.

Textul de pe ultima copertă

Back Cover CopySERIES:Integrated Circuits and Systems 3D-Integration for NoC-based SoC Architectures by: (Editors)Abbas Sheibanyrad Frédéric Petrot Axel Janstch This book investigates on the promises, challenges, and solutions for the 3D Integration (vertically stacking) of embedded systems connected via a network on a chip. It covers the entire architectural design approach for 3D-SoCs. 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures have emerged as topics critical for current R&D leading to a broad range of products. This book presents a comprehensive, system-level overview of three-dimensional architectures and micro-architectures. •Presents a comprehensive, system-level overview of three-dimensional architectures and micro-architectures; •Covers the entire architectural design approach for 3D-SoCs;•Includes state-of-the-art treatment of 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures.

Caracteristici

Provides a detailed background on the state of error control methods for on-chip interconnects, including Error Control Coding, Double Sampling, and On-Line Testing Describes the use of more complex concatenated codes such as Hamming Product Codes with Type-II HARQ, while emphasizing integration techniques for on-chip interconnect links Presents techniques for managing intermittent and permanent errors using a non-interrupting in-line test method with spare wire replacement Includes supplementary material: sn.pub/extras