Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
Autor E-H Wong et al.
22 mai 2015
Hardback
Preț: 938.44 lei 1031.25 lei
5-7 săpt.
-9%
Y.-W. Mai
Composite Technologies for 2020: Proceedings of the Fourth Asian-Australasian Conference on Composite Materials (Accm 4)
Editat de L Ye et al.
iun 2004
Hardback
Preț: 1925.21 lei 2115.62 lei
5-7 săpt.
-9%