Cantitate/Preț
Produs
Total produse
Vezi coșul
Three-Dimensional Molded Interconnect Devices (3D-Mid): Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers de Jörg Franke

Three-Dimensional Molded Interconnect Devices (3D-Mid): Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers

Editat de Jörg Franke
en Limba Engleză Hardback – 2 apr 2014
This book offers a comprehensive insight into the state of the art in 3D-MID technology along the entire process chain. Individual chapters, moreover, deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology.
Citește tot Restrânge

Preț: 83321 lei

Preț vechi: 101611 lei
-18%

Puncte Express: 1250
Preț estimativ în valută:
14756€ • 17233$ • 12818£

Carte disponibilă

Livrare economică 31 ianuarie-14 februarie

 Adaugă în coș

Wish list
Gift list
Am citit!
Adaugă în listă
Preluare comenzi: 021 569.72.76

Specificații

ISBN-13: 9781569905517
ISBN-10: 1569905517
Pagini: 356
Dimensiuni: 179 x 2405 x 39 mm
Greutate: 1 kg
Editura: Carl Hanser Publishers

Notă biografică

Prof. Dr.-Ing. Jörg Franke ist Leiter des Lehrstuhls für Fertigungsautomatisierung und Produktionssystematik (FAPS) an der Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU).