Thermal Management Strategies for Electronics: Basics, Applications and Emerging Innovations presents fundamentals and emerging trends in electronics cooling and thermal management. The power density of electronic devices continues to increase due to the continuous integration and miniaturization of chips and electronic components, posing challenges for thermal management of electronic devices. Chapters present fundamentals of electronics cooling and thermal management, including basic concepts in heat transfer. Emerging trends and techniques such as AI chips, power electronics, batteries, wearable devices, data centers, functional materials, additive manufacturing, machine learning, and testing and validation of various cooling solutions are examined. Case studies are included to demonstrate real world applications of these techniques. Detailed explanations of reduced-order thermal models for heat-generating components, fast fluid-thermal coupled models for heat sinks, and dynamic models of phase-change cooling systems, are presented. High level concepts such as the complexities of boundary conditions in engineering conditions are explained to to help readers identify nuanced errors in their work. Thermal Management Strategies for Electronics: Basics, Applications and Emerging Innovations is valuable to thermal engineers and electric engineers within various industry sectors, senior bachelor students, graduate students, and researchers in thermal engineering.

• Presents both fundamentals and emerging trends in electronics cooling and thermal management
• Demonstrates real-world application of emerging trends such as AI chips and power electronics through case studies, procedures, and protocols
• Explains concepts of such as complexities of boundary conditions and paradoxes in thermal management