Thermal Management in Microelectronics with Carbon-Based Composites: Woodhead Publishing Series in Composites Science and Engineering
Editat de Lin Qiu, Yichuan He, Yanghui Fengen Limba Engleză Paperback – feb 2027
The book will be a valuable reference resource for materials scientists and engineers, thermal scientists, as well as microelectronics/photonics researchers and postgraduate students working in above-related fields. The book uniquely offers a systematic, in-depth, and application-oriented resource, providing authoritative guidance for both research and industrial applications.
- Systematic and in-depth analysis of interfacial properties and heat transfer mechanisms in carbon nanotube/graphene assemblies
- Comprehensive treatment from fundamental theory to practical application including life cycle analysis and future outlooks
- Strong integration of recent advances, future opportunities, and cutting-edge developments
- Multidisciplinary approach spanning material synthesis, device integration, and performance analysis
- Covers the use of artificial intelligence in material design and analysis
- Includes details on molecular dynamics simulation related to heat transfer mechanisms and interface strengthening
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Specificații
ISBN-13: 9780443453588
ISBN-10: 0443453586
Pagini: 450
Dimensiuni: 152 x 229 mm
Editura: ELSEVIER SCIENCE
Seria Woodhead Publishing Series in Composites Science and Engineering
ISBN-10: 0443453586
Pagini: 450
Dimensiuni: 152 x 229 mm
Editura: ELSEVIER SCIENCE
Seria Woodhead Publishing Series in Composites Science and Engineering
Cuprins
1. Introduction
2. Thermal conductivity measurement methods and molecular dynamics simulations of carbon nanotubes
3. Thermal transport mechanism between carbon nanotubes
4. Thermal transport mechanism of carbon nanomaterial composite interface
5. Interface thermal transport mechanism of graphene composite materials
6. Conductivity mechanism and chip integration of carbon nanotube microelectronic devices
7. Mechanic-electrical coupling mechanisms and applications of flexible electronic devices
8. Charge transport mechanism and system integration of energy storage devices
9. Catalytic mechanism and system design of energy conversion Devices
10. Summary & Outlook
2. Thermal conductivity measurement methods and molecular dynamics simulations of carbon nanotubes
3. Thermal transport mechanism between carbon nanotubes
4. Thermal transport mechanism of carbon nanomaterial composite interface
5. Interface thermal transport mechanism of graphene composite materials
6. Conductivity mechanism and chip integration of carbon nanotube microelectronic devices
7. Mechanic-electrical coupling mechanisms and applications of flexible electronic devices
8. Charge transport mechanism and system integration of energy storage devices
9. Catalytic mechanism and system design of energy conversion Devices
10. Summary & Outlook
Notă biografică
Qiu Lin is Ph.D. of Institute of Engineering Thermophysics, Chinese Academy of Sciences (CAS), China, Postdoc of University of Virginia, USA, and Associate Professor of University of Science and Technology Beijing (USTB), China. She had conducted academic visits at Nanyang Technological University in Singapore and Leeds University in UK. The main research fields are Micro/Nanoscale Thermal Properties Measurement and Heat Transport Mechanism, and Recovery and Utilization of Waste Heat in Steel industry. She also has been invited to become the editorial board of Scientific Reports Member, and presided over the youth program and general program of NSFC, and the sub-projects of National Key R&D Plan, and participated in the key program of NSFC, the Chinese 973 Project, and the major instrument project of the Ministry of Science and Technology.