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Thermal Management in Microelectronics with Carbon-Based Composites: Woodhead Publishing Series in Composites Science and Engineering

Editat de Lin Qiu, Yichuan He, Yanghui Feng
en Limba Engleză Paperback – feb 2027
Thermal Management in Microelectronics with Carbon-Based Composites provides a comprehensive exploration of the design, mechanisms, and applications of carbon-based materials—such as graphene and carbon nanotubes—for advanced thermal management in microelectronic devices. The book’s objective is to address the mounting challenges posed by miniaturization and increasing power densities in microelectronics, especially the critical barrier of efficient heat dissipation. The book aims to bridge the gap between fundamental scientific theory and practical engineering solutions, focusing on enhancing the thermal conductivity and interfacial heat transfer of carbon nanomaterial assemblies. The book encompasses measurement methods, theoretical insights, interfacial heat transfer mechanisms, applications in devices, wearables and energy storage systems.

The book will be a valuable reference resource for materials scientists and engineers, thermal scientists, as well as microelectronics/photonics researchers and postgraduate students working in above-related fields. The book uniquely offers a systematic, in-depth, and application-oriented resource, providing authoritative guidance for both research and industrial applications.

  • Systematic and in-depth analysis of interfacial properties and heat transfer mechanisms in carbon nanotube/graphene assemblies
  • Comprehensive treatment from fundamental theory to practical application including life cycle analysis and future outlooks
  • Strong integration of recent advances, future opportunities, and cutting-edge developments
  • Multidisciplinary approach spanning material synthesis, device integration, and performance analysis
  • Covers the use of artificial intelligence in material design and analysis
  • Includes details on molecular dynamics simulation related to heat transfer mechanisms and interface strengthening
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Specificații

ISBN-13: 9780443453588
ISBN-10: 0443453586
Pagini: 450
Dimensiuni: 152 x 229 mm
Editura: ELSEVIER SCIENCE
Seria Woodhead Publishing Series in Composites Science and Engineering


Cuprins

1. Introduction
2. Thermal conductivity measurement methods and molecular dynamics simulations of carbon nanotubes
3. Thermal transport mechanism between carbon nanotubes
4. Thermal transport mechanism of carbon nanomaterial composite interface
5. Interface thermal transport mechanism of graphene composite materials
6. Conductivity mechanism and chip integration of carbon nanotube microelectronic devices
7. Mechanic-electrical coupling mechanisms and applications of flexible electronic devices
8. Charge transport mechanism and system integration of energy storage devices
9. Catalytic mechanism and system design of energy conversion Devices
10. Summary & Outlook