Semiconductor Power Devices
Autor Heinrich Schlangenotto, Josef Lutz, Rik Dedoncker, Uwe Scheuermannen Limba Engleză Hardback – 7 noi 2026
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Specificații
ISBN-13: 9783032234889
ISBN-10: 3032234883
Pagini: 361
Dimensiuni: 155 x 235 mm
Ediția:Third Edition 2026
Editura: Springer Nature Switzerland AG
ISBN-10: 3032234883
Pagini: 361
Dimensiuni: 155 x 235 mm
Ediția:Third Edition 2026
Editura: Springer Nature Switzerland AG
Notă biografică
Josef Lutz was Professor of Power Electronics and Electromagnetic Compatibility at TU Chemnitz, Germany, and is now staff member. His research focuses on power semiconductor devices, packaging, and reliability. He is widely recognized for inventing the Controlled Axial Lifetime (CAL) diode, a breakthrough in diode technology.
Heinrich Schlangenotto is a physicist based in Gütersloh, Germany, specializing in the physics of semiconductor power devices and their dynamic behavior. He pioneered the fast, soft recovery SPEED-diode, improving the performance of rectifier diodes.
Uwe Scheuermann worked for more than 30 years at Semikron in Nuremberg, Germany, in power module design, packaging technologies, and reliability. He contributed to introduce innovative packaging concepts such as spring contacts, shaping modern power module architecture.
Rik De Doncker is Professor at RWTH Aachen University, Germany, heading the Institute for Power Electronics and Electrical Drives (ISEA) and the Institute for Power Generation and Storage Systems (PGS) at E.ON ERC. His research focusses on power electronics and high-power converters. Among others, he is known for proposing in 1988 the three-phase Dual Active Bridge, a soft-switching bi-directional galvanically isolated DC-DC converter, a milestone in high-power medium-voltage converter technology.
Heinrich Schlangenotto is a physicist based in Gütersloh, Germany, specializing in the physics of semiconductor power devices and their dynamic behavior. He pioneered the fast, soft recovery SPEED-diode, improving the performance of rectifier diodes.
Uwe Scheuermann worked for more than 30 years at Semikron in Nuremberg, Germany, in power module design, packaging technologies, and reliability. He contributed to introduce innovative packaging concepts such as spring contacts, shaping modern power module architecture.
Rik De Doncker is Professor at RWTH Aachen University, Germany, heading the Institute for Power Electronics and Electrical Drives (ISEA) and the Institute for Power Generation and Storage Systems (PGS) at E.ON ERC. His research focusses on power electronics and high-power converters. Among others, he is known for proposing in 1988 the three-phase Dual Active Bridge, a soft-switching bi-directional galvanically isolated DC-DC converter, a milestone in high-power medium-voltage converter technology.
Cuprins
1. The Challenge of Packaging Technology.- 2. Package Types.- 3. Conventional Capsules.- 4. IGBT Presspacks.- 5. The TO-Family and Its Relatives.- 6. GaN Device Packages.- 7. Physical Properties of Materials.- 8. Thermal Simulation and Thermal Equivalent Circuits.