Materials for High-Density Electronic Packaging and Interconnection de National Research Council

Materials for High-Density Electronic Packaging and Interconnection

Autor National Research Council, Division on Engineering and Physical Sciences, National Materials Advisory Board, Commission on Engineering and Technical Systems, Committee on Materials for High-Density Electronic Packaging

en Limba Engleză Paperback – feb 1990

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Specificații

ISBN-13: 9780309042338
ISBN-10: 030904233X
Pagini: 156
Dimensiuni: 15 x 74 x 25 mm
Editura: National Academies Press