Lcp for Microwave Packages and Modules
Autor Anh-Vu H Pham, Morgan J Chen, Kunia Aiharaen Limba Engleză Hardback – 21 iun 2012
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Specificații
ISBN-13: 9781107003781
ISBN-10: 1107003784
Pagini: 266
Ilustrații: 227 b/w illus. 24 tables
Dimensiuni: 179 x 254 x 17 mm
Greutate: 0.67 kg
Ediția:New.
Editura: Cambridge University Press
Locul publicării:New York, United States
ISBN-10: 1107003784
Pagini: 266
Ilustrații: 227 b/w illus. 24 tables
Dimensiuni: 179 x 254 x 17 mm
Greutate: 0.67 kg
Ediția:New.
Editura: Cambridge University Press
Locul publicării:New York, United States
Cuprins
1. Introduction; 2. Characteristics of liquid crystal polymer (LCP) Morgan J. Chen, Kunia Aihara, Cheng Chen and Anh-Vu H. Pham; 3. Fabrication techniques for processing LCP laminates; 4. LCP for wafer level chip scale MEMS; 5. LCP for surface mount interconnects, packages, and modules; 6. LCP for passive components Hai Ta, Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 7. LCP for system design Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 8. LCP reliability.
Recenzii
'These foremost experts have created a compendium on microwave and millimeter-wave applications of LCP in packaging and modules that is clear and comprehensive, starting with materials science and theory, going through wide-ranging and current practical applications, and even covering all of the practical reliability aspects. Moreover, they have revealed in detail a host of design tricks (such as defected grounds) and advanced circuitry (such as a folded Marchand balun with a broadband even-mode matching network) that can enhance the designer's arsenal in general. We have here a valuable text for microwave designers at all levels.' Ed Stoneham, Stoneham Innovations
Descriere
A comprehensive overview of RF microelectronic design using Liquid Crystal Polymer (LCP) at package, component and system levels.