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Hybrid Systems-in-Foil: Elements in Flexible and Large-Area Electronics

Autor Mourad Elsobky, Joachim N. Burghartz
en Limba Engleză Paperback – 14 oct 2021
Hybrid Systems-in-Foil (HySiF) is a concept that extends the potential of conventional More-than-More Systems-in/on-Package (SiPs and SoPs) to the flexible electronics world. In HySiF, an economical implementation of flexible electronic systems is possible by integrating a minimum number of embedded silicon chips and a maximum number of on-foil components. Here, the complementary characteristics of CMOS SoCs and larger area organic and printed electronics are combined in a HySiF-compatible polymeric substrate. Within the HySiF scope, the fabrication process steps and the integration design rules with all the accompanying boundary conditions concerning material compatibility, surface properties, and thermal budget, are defined. This Element serves as an introduction to the HySiF concept. A summary of recent ultra-thin chip fabrication and flexible packaging techniques is provided. Several bendable electronic components are presented demonstrating the benefits of HySiF. Finally, prototypes of flexible wireless sensor systems that adopt the HySiF concept are demonstrated.
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Specificații

ISBN-13: 9781108984744
ISBN-10: 1108984746
Pagini: 75
Dimensiuni: 152 x 228 x 6 mm
Greutate: 0.14 kg
Ediția:Nouă
Editura: Cambridge University Press
Colecția Cambridge University Press
Seria Elements in Flexible and Large-Area Electronics

Locul publicării:Cambridge, United Kingdom

Cuprins

1. Flexible Electronics and Hybrid Systems-in-Foil; 2. Ultra-Thin Chip Fabrication and Flexible Packaging Technologies; 3. On-Foil Passive and Active Components; 4. Ultra-Thin Chip Characterization; 5. Hybrid Systems-in-Foil Demonstrators; Abbreviations; References.

Descriere

This Element serves as an introduction to the Hybrid Systems-in-Foil (HySiF) concept.